All lead free IGBT module with excellent reliability

机译：所有引线免费IGBT模块具有出色的可靠性

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The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.

机译：IGBT模块的无铅焊料应用的主题是温度循环试验中绝缘基板下焊料的可靠性。本文介绍了所有带优异可靠性的无铅IGBT模块。这是通过优化绝缘基板的热膨胀系数并使用Sn-Ag焊料来实现的。

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《International Conference on Semantic Technology and Information Retrieval》|2011年||共4页
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Nishimura Y.; Oonishi K.; Morozumi A.; Mochizuki E.; Takahashi Y.;
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中图分类 TP391-53;
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专利

1. All Lead-free IGBT Modules and IPMs [J] . Yoshitaka Nishimura, Tatsuo Nishizawa, Eiji Mochizuki Fuji electric review . 2007,第3期

机译：所有无铅IGBT模块和IPM
2. Lead-free IGBT Modules [J] . Yoshitaka Nishimura, Kazunaga Onishi, Eiji Mochizuki Fuji electric review . 2006,第2期

机译：无铅IGBT模块
3. Failure analysis of power modules: a look at the packaging and reliability of large IGBTs [J] . Lambilly H.D., Keser H.O. IEEE Transactions on Components, Hybrids, and Manufacturing Technology . 1993,第4期

机译：电源模块的故障分析：看大型IGBT的封装和可靠性
4. All lead free IGBT module with excellent reliability [C] . Nishimura Y., Oonishi K., Morozumi A., International Conference on Semantic Technology and Information Retrieval . 2011

机译：所有引线免费IGBT模块具有出色的可靠性
5. Impact of board pad finish on the tin-lead and lead-free solder interconnect reliability for leadless chip resistors under random vibration environment [D] . Plaza, Gustavo Alberto 2008

机译：随机振动环境下，无铅贴片电阻的电路板焊盘表面处理对锡铅和无铅焊料互连可靠性的影响
6. Reliability issues of lead-free solder joints in electronic devices [O] . Nan Jiang, Liang Zhang, Zhi-Quan Liu, 2019

机译：电子设备中无铅焊点的可靠性问题
7. Reliability analysis of MMCs considering sub-module designs with individual or series operated IGBTs [O] . Guo Jingli, Liang Jun, Zhang Xiaotong, 2016

机译：考虑带有单独或串联操作的IGBT的子模块设计的MMC的可靠性分析
8. Lead-Free vs Tin-Lead Reliability of Advanced Electronic Assemblies [R] . Ghaffarian, Reza 2005

机译：先进电子组件的无铅与锡铅可靠性

All lead free IGBT module with excellent reliability

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