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Infrared Brazing Ti_(50)Ni_(50) and Ti-15-3 Alloys Using Two Ag-based Fillers

机译:红外钎焊Ti_(50)Ni_(50)和Ti-15-3合金,使用两个Ag基填料

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Microstructural evolution of infrared brazed Ti_(5o)Ni_(50) shape memory alloy and Ti-15-3 using BAg-8 and Ticusil? active braze alloys is performed in the study. Only Ticusil? active braze readily wets both Ti_(50) Ni_(50) and Ti-15-3 substrates. The wettability of Ag-Cu braze on Ti_(50) Ni_(50) substrate is improved by adding 4. 5wt% Ti into the braze alloy. The brazed Ti_(50)Ni_(50)/BAg-8/Ti-15-3 joint is mainly comprised of Ag-rich matrix and Cu-Ti intermetallics. The formation of interfacial Cu-(Ni)-Ti intermetallic phases is attributed to the wetting of both substrates. The brazed Ti_(50)Ni_(50)/ Ticusil?/Ti-15-3 joint shows more vigorous reaction among filler metal and both substrates, resulting in forming huge amount of Cu-Ni-Ti intermetallic compounds in the joint.
机译:红外钎焊Ti_(50)Ni_(50)形状记忆合金和Ti-15-3使用BAG-8和TiCusil的微观结构演变?在研究中进行活性钎焊合金。只有ticusil?主动钎焊易于润湿Ti_(50)Ni_(50)和Ti-15-3基板。通过将4. 5wt%Ti加入钎焊合金,改善了Ti_(50)Ni_(50)粒子上的Ag-Cu钎焊剂的润湿性。钎焊的Ti_(50)Ni_(50)/袋-8 / Ti-15-3接头主要由Ag的基质和Cu-Ti金属间组成。界面Cu-(Ni)-ti金属间相的形成归因于两个基材的润湿。钎焊的Ti_(50)Ni_(50)/ TiCusIL?/ Ti-15-3接头在填充金属和两个基材中表明了更剧烈的反应,导致关节中形成大量的Cu-Ni-Ti金属间化合物。

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