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首页> 外文会议>IEEE International Symposium on Antennas and Propagation >A High-gain Large-scanning 60 GHz Via-fed Patch Phased Array Antenna
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A High-gain Large-scanning 60 GHz Via-fed Patch Phased Array Antenna

机译：高增益大扫描60 GHz Via馈电贴片阵列阵列天线

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摘要

This paper presents a 7 × 7 via-fed patch phased array antenna for next-generation communication systems. The low-profile antenna array is fabricated on a printed circuited board (PCB) resulting in a low-cost approach. While the via-fed design enables testing of the antenna component in a laboratory environment, it also provides a path for direct integration on a transceiver chip. The designed finite array is well matched at 60 GHz with the bandwidth covering 57 GHz to 64 GHz. The maximum realized gain for the 7 × 7 array is 22.15 dBi with the gain reduction of ≤ 4 dB under the condition of the maximum scanning angle. Moreover, the scanning volume of the designed antenna is ±55° in H plane and ±53° in E plane without using any superstrate. As a single-layer patch array, the designed array satisfies high gain and large scanning volume in both E and H planes.
机译：本文介绍了一个7×7的通送贴片阵列阵列天线，用于下一代通信系统。低调天线阵列在印刷的电路板（PCB）上制造，导致低成本的方法。虽然通媒设计能够在实验室环境中测试天线组件，但它还提供了一种用于直接集成收发器芯片的路径。设计的有限阵列在60 GHz良好匹配，带宽覆盖57 GHz至64 GHz。 7×7阵列的最大实现增益为22.15dBI，在最大扫描角度的条件下，增益减小≤4dB。此外，在H平面中，设计天线的扫描体积为±55°，在E平面中±53°而不使用任何叠层。作为单层贴片阵列，设计的阵列满足E和H平面中的高增益和大扫描体积。

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