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首页> 外文会议>International Conference on Chemical, Material and Metallurgical Engineering >Effects of Preparation Technology on the Microstructure and Thermal Conductivity of Cu-11Ni-2W Alloy
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Effects of Preparation Technology on the Microstructure and Thermal Conductivity of Cu-11Ni-2W Alloy

机译：制备技术对Cu-11Ni-2W合金微观结构和导热性的影响

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Cu-11Ni-2W alloys have been prepared by vacuum non-consumable arc-melting and high-frequency induction melting injection moulding. The effects of melting processes on the resultant microstructure were studied. The results show that the grain of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is coarse and the microstructure includes α solid solution and W particles. As for the sample prepared by high-frequency induction melting injection moulding, the grain is superfine and the microstructure is α solid solution. Moreover, the thermal conductivity coefficient for the sample prepared by vacuum non-consumable arc-melting is 67.2 W/(m·K), while that for high-frequency induction melting injection moulding is 47.8 W/(m·K). The melting point of Cu-11Ni-2W alloy prepared by vacuum non-consumable arc-melting is 1157.27°C.
机译：Cu-11Ni-2W合金通过真空非耗材弧熔化和高频感应熔化注塑制备。研究了熔化过程对所得微观结构的影响。结果表明，通过真空非耗材熔融制备的Cu-11Ni-2W合金的晶粒是粗糙的，微观结构包括α固溶体和W颗粒。至于通过高频感应熔化注射成型制备的样品，晶粒是超细的，微观结构是α固溶体。此外，通过真空非耗材弧熔化制备的样品的导热系数为67.2W /（m·k），而用于高频感应​​熔化的注塑成型为47.8W /（m·k）。通过真空非耗材弧熔化制备的Cu-11Ni-2W合金的熔点为1157.27℃。

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