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首页> 外文会议>International Conference on Silicon Photovoltaics >New methods to evaluate cleaning processes by detecting the particle load on surfaces of diamond wire sawn silicon wafers
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New methods to evaluate cleaning processes by detecting the particle load on surfaces of diamond wire sawn silicon wafers

机译：通过检测金刚石锯硅晶片表面上的粒子载荷来评估清洁过程的新方法

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Wafers for solar cell processing do not only have to fulfill high geometric requirements but also have to be as free of any contaminations as possible. Therefore the wafering process is followed by several cleaning steps whereby contaminations such as organics, metals and particles should be removed from the wafer surface. With increasing requirements the cleaning process has to be continuously improved. However, up to now there is no known method that allows a reproducible qualitative or quantitative detection of the remaining particle load at diamond wire sawn wafer surfaces. To evaluate the influence of modified cleaning methods on particular contamination a suitable detection method is absolutely indispensable. In this work two new methods are introduced making it possible to detect the remaining particle load on wafer surfaces. For the first time, quantitatively reproducible results are obtained for the particle load either as a sum parameter or as a grain size distribution. The functionality of the methods is evaluated to compare the effectiveness of different cleaning procedures on the final cleaning step in the wafering process.
机译：用于太阳能电池处理的晶片不仅必须满足高几何要求，而且必须尽可能不含任何污染物。因此，晶片处理之后是几个清洁步骤，由此应从晶片表面移除诸如有机物，金属和颗粒的污染物。随着需求的增加，清洁过程必须不断提高。然而，到目前为止，没有已知的方法，允许在金刚石锯晶片表面下的剩余粒子负载的可再现定性或定量检测。为了评估改进的清洁方法对特定污染的影响，合适的检测方法绝对不可发明。在这项工作中，引入了两种新方法，使得可以检测晶片表面上的剩余粒子负载。首次，将定量可重复的结果作为总和参数或晶粒尺寸分布获得。评估该方法的功能以比较不同清洁程序对晶片过程中最终清洁步骤的有效性。

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