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Investigations On 3-Dimensional Temperature Distribution In A FLATCON-Type CPV Module

机译:平板CPV模块中的三维温度分布研究

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The thermal flow in a FLATCON-type CPV module is investigated theoretically and experimentally. For the simulation a model in the computational fluid dynamics (CFD) software SolidWorks Flow Simulation was established. In order to verify the simulation results the calculated and measured temperatures were compared assuming the same operating conditions (wind speed and direction, direct normal irradiance (DNI) and ambient temperature). Therefore, an experimental module was manufactured and equipped with temperature sensors at defined positions. In addition, the temperature distribution on the back plate of the module was displayed by infrared images. The simulated absolute temperature and the distribution compare well with an average deviation of only 3.3 K to the sensor measurements. Finally, the validated model was used to investigate the influence of the back plate material on the temperature distribution by replacing the glass material by aluminum. The simulation showed that it is important to consider heat dissipation by radiation when designing a CPV module.
机译:理论上和实验研究了平板CPV模块中的热流。对于仿真在计算流体动力学(CFD)软件中的模型,建立了SolidWorks流程模拟。为了验证模拟结果,假设相同的操作条件(风速和方向,直接正常辐照度(DNI)和环境温度)进行比较计算和测量的温度。因此,制造实验模块并配备有限定位置的温度传感器。此外,通过红外图像显示模块的背板上的温度分布。模拟绝对温度和分布相比,平均偏差仅为3.3k到传感器测量。最后,通过通过铝更换玻璃材料来研究验证的模型来研究背板材料对温度分布的影响。模拟表明,在设计CPV模块时,重要的是考虑通过辐射散热。

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