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首页> 外文会议>Surface Mount Technology Association International Conference >EFFECT OF SOLDER COMPOSITION, PCB SURFACE FINISH AND SOLDER JOINT VOLUME ON DROP SHOCK RELIABILITY
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EFFECT OF SOLDER COMPOSITION, PCB SURFACE FINISH AND SOLDER JOINT VOLUME ON DROP SHOCK RELIABILITY

机译：焊料组成，PCB表面光洁度和焊接接头体积对降震可靠性的影响

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Drop shock reliability testing was performed on circuit boards assembled with several different lead-free solder alloys including SAC305 (Sn3.0Ag0.5Cu). The solder compositions tested range in Ag content from 0 to 3.0% by weight. Alloys with various secondary alloying elements were also included. All drop test boards were assembled such that the solder paste composition matched that of the BGA solder ball alloy to produce homogeneous solder joints of known compositions. An alternative test board design (not JEDEC standard) was used for this drop test evaluation. The test board contains a centrally located CABGA 256 package (17×17 mm body, 1 mm pitch). The board was designed with soldermask defined pads to minimize the occurrence of pad cratering failure modes in the laminate material. The test package was soldered to the drop board using either BGA or LGA interconnections to explore the effects of solder joint volume. Drop shock events were characterized with acceleration monitoring on the drop table and strain gage measurements on the mounted test boards. All samples were dropped until electrical failure. Solder joint microstructural analysis was performed on failing parts to establish the failure modes. The dominant failure mode was observed to be solder joint failure, either in the bulk solder or cracking along the interfacial intermetallic compound on the board pad. The effect of alloy silver content on drop reliability is noted. SAC305 solder joints were found to produce the best drop performance of all alloys tested for both BGA and LGA joint formats.
机译：在组装有几种不同的无铅焊料合金的电路板上进行掉落震动可靠性测试，包括SAC305（SN3.0AG0.5CU）。焊料组合物在0至3.0重量％的Ag含量中测试范围。还包括各种二级合金元素的合金。组装所有液滴测试板，使得焊膏组合物与BGA焊球合金的焊膏组合物匹配以产生已知组合物的均匀焊点。替代测试板设计（不是JEDEC标准）用于该跌落试验评估。测试板含有位于中心的CABGA 256封装（17×17毫米，1mm间距）。该板设计有焊料掩模定义的焊盘，以最大限度地减少层压材料中的垫喷射故障模式的发生。使用BGA或LGA互连焊接测试包焊接到液滴，以探索焊接接头体积的影响。下降冲击事件的特征在于在安装的测试板上的下落台和应变计测量的加速监测。所有样品均掉落直至电气故障。在发生故障部件以建立故障模式的情况下进行焊点微结构分析。显着的故障模式被观察到是焊接接头失效，在散装焊料中或沿着板垫上的界面金属间化合物开裂。注意到合金银含量对降液可靠性的影响。发现SAC305焊点产生对BGA和LGA联合格式测试的所有合金的最佳液滴性能。

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