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首页> 外文会议>CIRP International Conference on High Performance Cutting >Flow field analysis of the thin fluid film in disc hydrodynamic polishing
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Flow field analysis of the thin fluid film in disc hydrodynamic polishing

机译：盘流体动力抛光中薄液膜的流场分析

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Nowadays,large aspheric surfaces,including non-rotationally-symmetnc surfaces,are increasingly used in ground and space-based astronomical instruments The fabrication of these surfaces with sub-micrometric form accuracy and nanometric surface finish,especially for hard and difficult-to-machine materials,has always been a challenge to the optics industry.To efficiently produce ultra-smooth surfaces without the subsurface damage and surface scratches,a novel Disc Hydrodynamic Polishing(DHDP)is proposed by the combination of Elastic Emission Machining(EEM)and Fluid Jet Polishing(FJP).Firstly,the polishing tool for DHDP was carefully designed and the feasibility of the proposed method was experimentally verified.It is interesting to find that the liquid film acts as a carrier of abrasive grains between the polishing tool and polished surface Then,computational fluid dynamics(CFD)was used to study the effects of process parameters on the slurry film flow in disc hydrodynamic polishing.Finally,preliminary experiments are conducted to verify the CFD simulations.The experimental data reasonably agree with the simulation results.The results also show that increasing rotation speed has no influence on the film thickness for polishing tool without grooves,but leads to increased film thickness for polishing tool with grooves.The film thickness increases as the inlet pressure is increased for these two polishing tools.
机译：如今，包括非旋转 - 对称表面的大型非球面，越来越多地用于地面和空间的天文仪器，具有亚微米的精度和纳米表面光洁度的这些表面的制造，尤其是硬且难以机材料一直是光学行业的挑战。在没有地下损伤和表面划痕的情况下有效生产超光滑表面，通过弹性发射加工（EEM）和流体射流的组合提出了一种新型圆盘流体动力抛光（DHDP）抛光（FJP）。首先，精心设计了用于DHDP的抛光工具，并经过实验验证了所提出的方法的可行性。很有意思地发现液膜作为抛光工具和抛光表面之间的磨粒的载体。 ，计算流体动力学（CFD）用于研究过程参数对盘流体动力抛光中浆料膜流量的影响。FINAL进行初步实验以验证CFD模拟。实验数据合理地与模拟结果一致。结果还表明，增加的旋转速度对抛光工具的膜厚度没有影响而没有凹槽，但导致膜厚度增加具有凹槽的抛光工具。当这两个抛光工具增加了入口压力时，膜厚度增加随着入口压力。

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