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Study on thermal degradation of high power LEDs during high temperature and electrical aging

机译：高温电气老化高功率LED热劣化研究

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摘要

As a new kind of semiconductor photoelectric device, light-emitting diodes (LEDs) have begun to play an important role in many illumination applications due to their excellent performance in terms of high brightness, energy-saving and environment friendly. However, thermal management is one of the major issues to be improved for implementing LEDs into illumination applications because heat affects the light performance and reliabilities. So most of manufacturers try to use high thermal conductivity material to lower the thermal resistance from the p-n junction to the LED board, and then the junction will be at a lower temperature during operation. In this paper, accelerated aging tests with high temperatures and currents were carried out on the LEDs. T3Ster was used to analyze the heat conduction path which influenced the luminous efficiency, the die-attached interfaces thermal resistance significantly increased after aging test, the more of the accelerated stress, the great die-attached interfaces thermal resistance increase. Voids in the die-attached may not only lead to increase of the junction temperature, but also result in the addition of the temperature difference. Accordingly, the results were helpful in enhancing the performance and reliability of high-power LEDs.
机译：作为一种新的半导体光电器件的，发光二极管（LED）已开始发挥在许多照明应用中起重要作用，因为它们在高亮度方面优异的性能，节能和环境友好的。然而，热管理是用于实现LED进入照明应用的主要问题之一，因为热量影响光性能和可靠性。因此，大多数制造商都尝试使用高导热性材料来降低来自P-N结的热阻，然后在操作期间连接在较低的温度下。本文在LED上进行了高温和电流的加速老化试验。 T3Ster用于分析影响发光效率的导热路径，模具附近的接口在老化测试后热阻显着增加，越来越加速应力，较大的模具连接界面热阻增加。模具中的空隙可能不仅可以导致结温增加，而且还导致添加温差。因此，结果有助于提高大功率LED的性能和可靠性。

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