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Elevated temperature microcompression transient testing of nanocrystalline materials: Creep, stress relaxation and strain rate jump tests

机译：纳米晶体材料的高温微块瞬态试验：蠕变，应力松弛和应变率跳跃测试

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Traditionally, time-dependent properties of nanocrystalline metals have been measured on bulk samples. With the advent of thin film deposition techniques like sputtering and electrodeposition for fabricating nanocrystalline materials, it has become necessary to adapt bulk mechanical testing for thin films. Nanoindentation has been extensively applied for this purpose, particularly on thin films where conventional testing is difficult or impossible, and has been demonstrated to successfully extract strain rate exponents [1]. However, the interpretation of the indentation results can be difficult due to the complex stress state, and the nearly instantaneous onset of large-strain plasticity. Microcompression, on the other hand, is advantageous due to the relatively simple, well understood uniaxial stress state.
机译：传统上，在批量样品上测量了纳米晶金属的时间依赖性。随着薄膜沉积技术的出现，如溅射和电沉积的用于制造纳米晶体材料，可以适应薄膜的散装机械测试是必要的。纳米indentation已经广泛地应用于此目的，特别是在诸如常规测试的薄膜上，并且已经证明成功提取应变率指数[1]。然而，由于复力状态复合状态和大应变塑性的几乎瞬时发作，对压痕结果的解释可能是困难的。另一方面，微血压由于相对简单，很好地理解的单轴应力状态是有利的。

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