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Effect of pulse electrodeposition on Sn-Cu Coatings for Pb-free applications - (PPT)

机译:脉冲电沉积对无铅应用Sn-Cu涂料的影响 - (PPT)

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Sn-Cu alloy electrodeposits were composed of thin columnar grains and copper was in the form of Cu_6Sn_5 IMCs precipitated in the grain boundaries. During PC 'off' time a nanometre thick immersion deposit of Cu is formed. The Cu immersion deposit rapidly reacts with Sn to form Cu-Sn intermetallic. With very high 'off' time Sn migration can cause holes to appear in the deposit. Immersion deposit formed during PC 'off time' increases Cu content in alloy deposit.
机译:SN-Cu合金电沉积物由薄柱状晶粒组成,铜以晶界沉淀的Cu_6SN_5 IMC的形式。在PC'OFF'期间,形成Cu的纳米厚的浸渍沉积物。 Cu浸渍沉积物快速反应,以形成Cu-Sn金属间金属间。非常高的'OFF'时间SN迁移可以导致储蓄中出现孔。在PC'OFF时间'期间形成的浸渍沉积物增加了合金沉积物中的Cu含量。

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