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Precision asphere and freeform optics manufacturing using plasma jet machining technology

机译：使用等离子喷气机加工技术精密间谍和自由形式光学制造

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Atmospheric Plasma Jet Machining is a non-conventional deterministic sub-aperture surface processing technique that employs a local chemical etching process for material removal. It was shown to have great technological potential for the manufacturing and correction of precision optical surfaces made preferably from fused silica, ULE, silicon, or silicon carbide. A plasma based processing chain suitable for freeform generation or surface correction comprises high-rate plasma etching for freeform generation (removal rate 1-30 mm~3/min), bonnet polishing for smoothing, plasma fine correction (removal rate 0.01-1 mm~3/min) to achieve minimal surface figure error and a post-polishing step utilizing a soft tool. Since plasma jets are not only a source of reactive species but also of heat, the chemical reaction during processing depends on the resulting local surface temperature distribution. A coupled model involving finite elements for temperature field analysis and sophisticated dwell time calculation algorithms has been developed to simulate the complex interplay of surface heating and material removal. With it, the convergence of the etching process is significantly increased. Sub-aperture polishing on freeforms suffers from inhomogeneities in material removal depending on local surface curvatures. An analytical approach has been chosen to estimate the material removal during polishing and appropriate measures have been undertaken to preserve the plasma-generated surface shape. By combination of the processing steps and applying the theoretical modeling fast and efficient precision freeform manufacturing aiming at residual errors of less than 30 nm PV becomes possible.
机译：大气等离子体喷射加工是一种非传统的确定性子孔径表面处理技术，采用局部化学蚀刻工艺进行材料去除。它被证明具有优选地由熔融二氧化硅，ULE，硅或碳化硅制造的制造和校正的巨大技术潜力。适用于自由形式产生或表面校正的基于等离子体的处理链包括用于自由形态的高速等离子体蚀刻（去除率1-30mm〜3 / min），用于平滑的阀帽抛光，等离子细校正（去除率0.01-1 mm〜 3 / min）以实现利用软工具的最小表面图误差和后抛光后介绍。由于等离子体喷射不仅是反应性物质的来源，而且是热量，因此加工过程中的化学反应取决于所得局部表面温度分布。已经开发了一种涉及用于温度场分析和复杂停留时间计算算法的有限元的耦合模型，以模拟表面加热和材料的复杂相互作用。通过它，蚀刻过程的收敛性显着增加。根据局部表面曲率，自由形状上的副孔径抛光遭受材料去除中的不均匀性。已经选择分析方法来估计抛光期间的材料去除，并进行了适当的措施以保持等离子体产生的表面形状。通过处理步骤和应用理论模型的快速和有效的精密自由形状制造，旨在留在小于30nm PV的残余误差。

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