Preparation and Curing Behaviour of N-phenylmaleimide-styrene-maleic Anhydride Copolymer/o-cresol Formaldehyde Epoxy Resin Composite System

机译：N-苯基马来酰亚胺 - 苯乙烯 - 苯乙烯 - 酸酐共聚物/ O-甲酚甲醛环氧树脂复合系统的制备及固化行为

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Epoxy resin was used as the dielectric ink with some undesirable properties, such as a highdielectric constant, high dissipation factor and low thermal stability, In this paper, aNSMA/OCFEP.system were prepared, and the properties and curing behavior of the NSMA/ OCFEPsystem were intensively studied. Theoretical analysisi on the curing process of the system showed thatwhen the weight ratio is 2.0:1.0, the best thermal stability is achieved.

机译：使用环氧树脂作为介电油墨，具有一些不希望的性质，例如高电常数，高耗散因子和低热稳定性，在本文中，制备了ansma / OCFep.System，以及NSMA / OCFepsystem的性质和固化行为集中研究。系统的固化过程的理论分析表明，重量比为2.0：1.0，实现了最佳的热稳定性。

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《International Conference on Nano Materials and Electric Devices》|2013年||共4页
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Mengyi Xu; Liang Zhou; Meijuan Yin;
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中图分类 TB383-532;
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NSMA/OCFEP composite system; Curing process; DSC/TG analysis;

机译：NSMA / OCFEP复合系统;固化过程;DSC / TG分析;

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2. Curing Behaviour of Polycyanate Ester/o-Cresol Formaldehyde Epoxy Resin Composite System [J] . Pihui Pi, Weichuang Lin, Dafeng Zheng, Iranian polymer journal . 2010,第6期

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3. Curing kinetics of o-cresol formaldehyde epoxy resin and succinic anhydride system catalyzed by tertiary amine [J] . Ma ZG, Gao JG The journal of physical chemistry, B. Condensed matter, materials, surfaces, interfaces & biophysical . 2006,第25期

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4. Preparation and Curing Behaviour of N-phenylmaleimide-styrene-maleic Anhydride Copolymer/o-cresol Formaldehyde Epoxy Resin Composite System [C] . Mengyi Xu, Liang Zhou, Meijuan Yin International Conference on Nano Materials and Electric Devices . 2013

机译：N-苯基马来酰亚胺 - 苯乙烯 - 苯乙烯 - 酸酐共聚物/ O-甲酚甲醛环氧树脂复合系统的制备及固化行为
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8. The Stability of New Transparent Polymeric Materials: The Epoxy Trimethoxyboroxine System. Part 1: The Preparation, Characterization and Curing of Epoxy Resins and Their Copolymers [R] . Pearce, E., Lin, S. C. 1981

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Preparation and Curing Behaviour of N-phenylmaleimide-styrene-maleic Anhydride Copolymer/o-cresol Formaldehyde Epoxy Resin Composite System

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