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首页> 外文会议>Regional Conference of the Polymer Processing Society >Back Injection Molding Of FR4 With Heat Conductive Polymers
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Back Injection Molding Of FR4 With Heat Conductive Polymers

机译：用导热聚合物背注射成型FR4

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摘要

In this work, a new concept for the intrinsic cooling of PCBs is investigated. This concept is based on the back injection molding of pre-structured flame retardant glass fiber-reinforced epoxy laminate sheets (FR4), as they are commonly used as substrate materials for PCBs, with heat conductive thermoplastics. Primary functionality of this heat conductive layer is the spreading as well as the local dissipation of heat. Therefore, compounds based on high temperature thermoplastics and heat conductive fillers were produced via extrusion technology. FR4-cuts of 0.25 mm thicknesses were back injection molded in a standard injection molding machine. Mold temperature, injection pressure and holding pressure were optimized during the injection molding process. The cooling performances of the multilayer composites were tested. The results showed that heat conductive polymers with a sufficient adhesion to FR4 could be achieved. Low thermal expanding ceramic fillers were used to align the coefficients of thermal expansion (CTEs) of FR4 and thermoplastic. Thus, distortion free multilayer composites were obtained. Further experiments showed that the back injection molding of FR4 with heat conductive polymers could enhance its cooling performance. Especially in combination with fine drilling channels in the FR4, which were filled with heat conductive polymer during the injection molding process, the temperatures on the FR4 surfaces could be decreased.
机译：在这项工作中，研究了PCB的内在冷却的新概念。该概念基于预先构造的阻燃玻璃纤维增​​强环氧树脂层压板（FR4）的后注射成型，因为它们通常用作PCB的底物材料，具有导热性热塑性塑料。该导热层的主要功能是展开以及热量的局部耗散。因此，通过挤出技术生产基于高温热塑性塑料和导热填料的化合物。将0.25mm的厚度为0.25mm厚度在标准注射成型机中进行背部注塑。在注塑过程中优化了模具温度，注射压力和保持压力。测试了多层复合材料的冷却性能。结果表明，可以实现具有足够粘合至FR4的导热聚合物。低热膨胀陶瓷填料用于对准FR4和热塑性塑料的热膨胀系数（CTE）。因此，获得了无变形多层复合材料。进一步的实验表明，具有导热聚合物的FR4的后注射成型可以提高其冷却性能。特别是与FR4中的细钻通道组合，在注射成型过程中填充导热聚合物，可以降低FR4表面上的温度。

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