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Effect of Powder Form and SPS Process Sintering on CuCr50 Alloy Powder

机译:粉末形式和SPS工艺烧结在CUCR50合金粉末中的影响

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This paper introduces the technology of activating CuCr50 alloy powder by MA(Mechanical Alloying) and sintering CuCr50 powder by SPS(Spark Plasma Sintering). It analyzes the effect on electrical conductivity and hardness of CuCr50 alloy when Cu powder in different morphology. The results indicate that the CuCr50 powder sintered by SPS takes a good sintering shape, whose electrical conductivity and hardness get improved. At the same time, CuCr50 alloy density has been improved. The flake morphology Cu powder improves the electrical conductivity of 32.7% than the pine morphology needle Cu powder. And the bigger flake Cu powder is, the better CuCr50 alloy electrical conductivity is. Adding 1% of the mass fraction of graphite powder and carbon nanotubes into CuCr50 alloy, whose effect of improving the electrical conductivity is not obvious. CuCr contact material has excellent mechanical and electrical properties and is widely used in vacuum switchgear[1]. As contact materials, CuCr50 alloy can play such an important role in the actual production and application. Improving the mechanical properties and electrical performance are the main trend for development of high performance CuCr alloy.
机译:本文介绍了MA(机械合金化)激活CUCR50合金粉末的技术,SPS(火花等离子烧结)烧结CUCR50粉末。它分析了Cu粉在不同形态学时CuCr50合金的电导率和硬度的影响。结果表明,SPS烧结的CuCr50粉末采用良好的烧结形状,其电导率和硬度得到改善。同时,CUCR50合金密度已得到改善。片状形态Cu粉末提高了比松树形态针Cu粉的导电率为32.7%。并且较大的薄片Cu粉末是,越好的CUCR50合金电导率是。将石墨粉末和碳纳米管的质量分数的1%加入CuCr50合金中,其改善电导率的效果不明显。 CUCR接触材料具有优异的机械和电气性能,广泛用于真空开关柜[1]。作为接触材料,CUCR50合金可以在实际生产和应用中发挥如此重要的作用。改善机械性能和电气性能是高性能CUCR合金发展的主要趋势。

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