首页> 外文会议>Internation Conference on Advanced Materials with Hierarchical Structure for New Technologies and Reliable Structures >Silver-Containing Polymer Composition Used in Spacecraft and Semiconductor Optoelectronics Control Systems
【24h】

Silver-Containing Polymer Composition Used in Spacecraft and Semiconductor Optoelectronics Control Systems

机译:用于航天器和半导体光电子控制系统的含银的聚合物组合物

获取原文

摘要

The copolymer of the vinyl chloride-maleic anhydride and silver nano- and microparticle (70 wt %) composition is offered as a conductive adhesive for fixing various chips on the dielectric substrate. The wiring volume resistivity is up to 3.1 10~(-8) Ohm m. The adhesive strength of the silver-containing polymer composition (70% of Ag) applied under a shear on the dielectric substrate is 106 N/mm~2. Adhesive layers obtained from these substances have a high thermal conductivity up to λ = 199.93 W/m K that depends on the amount of Ag in the polymer composition.
机译:氯乙烯 - 马来酸酐和银纳米和微粒(70wt%)组合物的共聚物作为导电粘合剂,用于在介电基板上固定各种芯片。布线容积电阻率高达3.1 10〜(-8)欧姆m。在介电基板上的剪切下施加的含银聚合物组合物(70%Ag)的粘合强度为106n / mm〜2。由这些物质获得的粘合剂层具有高达λ= 199.93W / M k的高导热率,这取决于聚合物组合物中的Ag的量。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号