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首页> 外文会议>Electrochemical Society;International Symposium on Dielectrics for Nanosystems: Materials Science, Processing, Reliabliity, and Manufacturing >Dynamic Observation of Electromigration in Electroplated Nanotwinned Copper through In-situ TEM
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Dynamic Observation of Electromigration in Electroplated Nanotwinned Copper through In-situ TEM

机译：通过原位温度动态观察电镀纳米电铜电迁移的动态观察

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Electromigration(EM) has become an important issue due to the revolution of scale-down devices in integrated circuit industry. In this study, we introduce high-density electroplated nanotwins into copper, and the EM rate on surface can be measured through in-situ transmission electron microscope(TEM). Moreover, in-situ experiment also provides real time observation on atomic variation of the surface structure. The EM rate has found to be retarded at the triple points, which is significantly slower than previous researches, and improve the durability of the device. Furthermore, the free surface where a twin intersects is transform to a zigzag surface, consisting of alternating (200)/(111) planes. And Cu atoms were gradually removed along (111) when applying a current with a density of 10~4 A/cm~2.
机译：电迁移（EM）已成为集成电路行业中缝线设备的革命，成为一个重要问题。 在本研究中，我们将高密度电镀纳米电线引入铜中，并且可以通过原位透射电子显微镜（TEM）测量表面上的EM速率。 此外，原位实验还提供了关于表面结构原子变化的实时观察。 EM率已发现在三重点延迟，这比以前的研究显着慢，提高了装置的耐用性。 此外，双交叉的自由表面变换为Z字形表面，由交替（200）/（111）平面组成。 当施加密度为10〜4a / cm〜2时，沿（111）逐渐去除Cu原子。

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