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Optimization Method for Heat Dissipation Micro-Channel of 3D System in a Package

机译：包装中3D系统散热微通道的优化方法

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摘要

In order to solve the high-power 3D-SiP thermal problem, traditional solutions often optimize heat dissipation from new materials or new structures, which may increase the manufacturing process complexity of 3D-SiP and bring more trouble. So this paper proposes an optimization method to improve the heat dissipation performance of high-power 3D-SiP from the structure and layout of micro-channels. Firstly, the cross-section shape parameters and the number of micro-channels are optimized, using the Design of Experiments method(DOE). Secondly, the Fractal theory and the fin type micro-channel are combined and applied to the micro-channel layout optimization design. Three new layouts are proposed in this paper: parallel fin type micro-channel layout, stagger fin type micro-channel layout and tree fin type micro-channel layout. Comparing junction temperature, chip temperature difference and package thermal resistance, the tree fin type micro-channel layout is better. This paper provides an effective solution for thermal design of high-power 3D-SiP, which reduces the chip junction temperature by 5.69°C and the thermal resistance by 37.44%.
机译：为了解决高功率3D-SiP的热的问题，传统的解决方案从新材料或新结构，这可以增加3D-SiP的制造过程的复杂性和带来更多的麻烦经常优化散热。因此，本文提出了一种优化方法，以改善高功率3D-SiP的从结构的微通道的散热性能和布局。首先，横截面形状参数和微通道的数目进行优化，采用实验方法（DOE）的设计。其次，分形理论和翅片型微通道合并并施加到微通道布局优化设计。三个新的布局中提出了本文：平行翅片型微通道的布局，交错鳍型微通道的布局和树鳍型微通道的布局。比较结温，芯片温度差和封装热阻，树鳍型微通道的布局比较好。本文提供了一种用于高功率3D-SiP的，这降低了由5.69℃的芯片结温，并通过37.44％的热阻的热设计一种有效的解决方案。

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