Study on ultrasonic fusion bonding for polymer microfluidic chips

机译：聚合物微流控芯片的超声熔合研究

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directors in ultrasonic bonding process. In this paper, a novel micro joint including energy directors and flow blocks is presented. The flow profile of the melted energy directors is controlled by the dimensions of the flow blocks, auxiliary energy-equilibrating structures are also designed to prevent the uneven melt of energy directors. Polymethyl methacrylate (PMMA) microfluidic chips with the new joints were fabricated and ultrasonic bonding experiments were conducted. Micro channels with characteristic dimension of tens of microns were successfully sealed in 0.3 s and free of deformation.

机译：超声熔合是聚合物微流控芯片大规模生产的一种潜在方法。但是，由于超声键合过程中熔化的能量指向矢的可控性和均匀性差，芯片中的微结构很容易损坏甚至破坏。在本文中，提出了一种新型的包括能量导向器和流动块的微接头。熔化的能量导向器的流量曲线由流量块的尺寸控制，还设计了辅助能量平衡结构，以防止能量导向器不均匀熔化。制备了具有新接头的聚甲基丙烯酸甲酯（PMMA）微流控芯片，并进行了超声键合实验。特征尺寸为数十微米的微通道在0.3 s内成功密封且没有变形。

著录项

来源
《International Conference of Chinese Society of Micro-Nano Technology;Annual Conference of the Chinese Society of Micro-Nano Technology》|2010年|p.311-315|共5页
会议地点 Xian(CN);Xian(CN)
作者
Yi Luo; Shengqiang He; Liangjiang Wang; Zongbo Zhang;
展开▼
作者单位

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, China;

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, China;

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, China;

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, China;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类光学仪器;微电子学、集成电路（IC）;
关键词
ultrasonic bonding; energy director; fusion; polymer microfluidic chip;

机译：超声波粘接能源总监；融合聚合物微流控芯片;

相似文献

外文文献
中文文献
专利

1. Energy director structure and self-balancing jig for the ultrasonic bonding of microfluidic chips [J] . Jingmin Li, Fanjian Meng, Chao Liang, Micro & Nano Letters, IET . 2017,第7期

机译：用于微流控芯片超声粘接的能量导向器结构和自平衡夹具
2. A low temperature ultrasonic bonding method for PMMA microfluidic chips [J] . Zongbo Zhang, Yi Luo, Xiaodong Wang, Microsystem Technologies . 2010,第4期

机译：PMMA微流控芯片的低温超声粘接方法
3. A low temperature ultrasonic bonding method for PMMA microfluidic chips [J] . Zongbo Zhang, Yi Luo, Xiaodong Wang, Microsystem Technologies . 2010,第4期

机译：PMMA微流控芯片的低温超声粘接方法
4. Study on ultrasonic fusion bonding for polymer microfluidic chips [C] . Yi Luo, Shengqiang He, Liangjiang Wang Annual Conference of the Chinese Society of Micro-Nano Technology . 2011

机译：聚合物微流体芯片超声融合键合研究
5. Two-Photon Polymerization Towards Organ-on-a-Chip: Prototyping of a Bio-Compatible Microfluidic Chip [D] . Di Giuda, Edoardo. 2018

机译：双光子聚合朝鲜有机芯片：生物相容的微流体芯片的原型
6. Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip [O] . Mingyong Zhou, Xiang Xiong, Dietmar Drummer, 2019

机译：结合压力对聚合物微流控芯片热结合影响的分子动力学模拟
7. Study on ultrasonic fusion bonding for polymer microfluidic chips [O] . Yi Luo A, Shengqiang He, Liangjiang Wang, 2016

机译：聚合物微流控芯片的超声熔接研究

Study on ultrasonic fusion bonding for polymer microfluidic chips

摘要

著录项

相似文献

相关主题

期刊订阅