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首页> 外文会议>International Conference of Chinese Society of Micro-Nano Technology;Annual Conference of the Chinese Society of Micro-Nano Technology >Low Cost Fabrication of Micro Glass Cavities For MEMS Wafer Level and Hermetic Packaging
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Low Cost Fabrication of Micro Glass Cavities For MEMS Wafer Level and Hermetic Packaging

机译：低成本制造用于MEMS晶圆级和密封包装的微玻璃腔

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摘要

Many MEMS devices including accelerometer and gyroscopes, having moving parts, requires hermetic and low cost packaging. In this paper we propose a low cost fabricating process to prepare micro glass cavity arrays for wafer-level and hermetic packaging of MEMS. First, the fundamental of the process was discussed. Then, the process for preparing cavity arrays in Pyrex7740 glass wafer was studied experimentally. After that, the defects of the fabrication were discussed. Results show that wafer-level packaged cavities were prepared, whose diameter was controllably between 200 microns and 2000 microns. It is also disclosed that the defects could be avoided by controlling the process parameters. Results also show that the leakage rate of the single packaged cavities is below 5×10~(-9) Pa.m/s which could meet the hermetic packaging standard.
机译：许多具有运动部件的MEMS设备（包括加速度计和陀螺仪）需要密封且低成本的封装。在本文中，我们提出了一种低成本的制造工艺，以制备用于MEMS的晶圆级和气密封装的微玻璃腔阵列。首先，讨论了过程的基础。然后，实验研究了在Pyrex7740玻璃晶片中制备腔阵列的工艺。之后，讨论了制造的缺陷。结果表明，制备了晶圆级封装的腔体，其直径可控制在200微米至2000微米之间。还公开了可以通过控制工艺参数来避免缺陷。结果还表明，单腔型腔的泄漏率低于5×10〜（-9）Pa.m / s，可以满足密闭包装标准。

著录项

  • 来源
  • 会议地点 Xian(CN);Xian(CN)
  • 作者

    Jintang Shang; Junwen Liu; Di Zhang; Boyin Chen; Chao Xu; Xinhu LUO; Hui Yu; Jingdong Liu; Qing-An Huang; Jieying Tang; Ming Qin;

  • 作者单位

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

    Key Laboratory of MEMS of Ministry of Education, Southeast University, Sipailou 2, Nanjing, Jiangsu, China, 210096;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 光学仪器;微电子学、集成电路（IC）;
  • 关键词

    glass cavity; MEMS; packaging; wafer level; hermetic;

    机译：玻璃腔MEMS;打包;晶圆水平；密闭;

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