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首页> 外文会议>Microelectromechanical structures for materials research >MESO (INTERMEDIATE)-SCALE ELECTROMECHANICAL SYSTEMS FOR THE MEASUREMENT AND CONTROL OF SAGGING IN LTCC STRUCTURES
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MESO (INTERMEDIATE)-SCALE ELECTROMECHANICAL SYSTEMS FOR THE MEASUREMENT AND CONTROL OF SAGGING IN LTCC STRUCTURES

机译：用于测量和控制LTCC结构下垂的中观（中间）规模机电系统

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摘要

Sagging of suspended or laminated structures is a common problem in the processing of Low Temperature Co-Fired Ceramics (LTCC). These glass-ceramic composites are susceptible to plastic deformation upon lamination, or under the stress of body forces once the glass transition temperature of the glass binder is reached during processing. We have designed and fabricated, using the conventional methods of LTCC fabrication, meso-scale structures (ranging in size from 100 mm to 1 cm) to quantify and seek control strategies for this problem. We have implemented bridge structures and membranes to emulate most of the conventional structures encountered during packaging or sensor (actuator) device fabrication.rnWe have observed that when an LTCC tape with holes larger than 400 μm in diameter is laminated, the tapes above and below deform into the cavity. For smaller diameters, deformation is negligible. Bridging structures can be compensated for the potential effect of body forces by screen-printing a thick film over-layer which exert internal tensile stresses on sintering. This can often yield straight bridges. The use of fugitive phase materials, which disappear or flow during firing, is another way of supporting bridging structures. Several of these strategies have been explored, and results are presented.
机译：在低温共烧陶瓷（LTCC）的加工中，悬浮结构或层压结构的下垂是一个普遍的问题。一旦在加工过程中达到玻璃粘合剂的玻璃化转变温度，这些玻璃-陶瓷复合材料在层压时或在体力的应力下容易发生塑性变形。我们使用LTCC制造的常规方法设计和制造了中尺度结构（尺寸从100毫米到1厘米不等），以量化并寻求针对此问题的控制策略。我们已经实现了桥结构和膜，以模拟在包装或传感器（执行器）器件制造过程中遇到的大多数常规结构.rn我们已经观察到，当层压直径大于400μm的孔的LTCC胶带时，上下的胶带会变形进入空腔。对于较小的直径，变形可以忽略不计。可以通过丝网印刷在烧结过程中施加内部拉应力的厚膜覆盖层来补偿架桥结构对体力的潜在影响。这通常可以产生直的桥。在烧结过程中消失或流动的逃逸相材料的使用是支撑桥接结构的另一种方式。已经探索了其中几种策略，并给出了结果。

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