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SILICON STRENGTH TESTING FOR MESOSCALE STRUCTURAL APPLICATIONS

机译：中尺度结构应用的硅强度测试

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The development of power MEMS, such as the Microengine being developed at MIT, requires highly stressed structures to achieve high power densities. Material strength is, therefore, a critical issue for the design of such devices. Due to the stochastic nature of the strength of brittle materials, the length scales of the test specimens should be close to those of the structure in order to avoid excessive extrapolation of the test data. In this paper, strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens are presented. The Weibull reference strength1 of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa, depending on the surface quality. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was found to be significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. It was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step. The test results reported herein have important implications for the development of highly stressed microfabricated structures. The sensitivity of the mechanical strength to surface processing and etching techniques must be accounted for in the design cycle, particular with regard to the selection of the appropriate fabrication route. Furthermore, in the design of highly stressed MEMS devices, it is important to account for the stochastic nature of the material strength.
机译：功率MEMS的发展，例如麻省理工学院（MIT）开发的微引擎，需要高应力的结构才能实现高功率密度。因此，材料强度是设计此类设备的关键问题。由于脆性材料的强度具有随机性，因此试样的长度标尺应接近结构的长度标尺，以避免过多外推测试数据。本文介绍了中尺度双轴弯曲和弧形轮毂弯曲单晶硅试样的强度表征和支撑分析。平面双轴挠性试样的威布尔参考强度1被发现在1.2至4.6 GPa的范围内，具体取决于表面质量。应力集中的局部强度是通过测试半径较大的轮毂挠性试样获得的。对于深反应离子蚀刻（DRIE）样品，由于这种区域的表面质量较差，因此发现圆角半径的强度明显低于从平面双轴挠性样品测量的强度。已经发现，通过在DRIE步骤之后引入另外的各向同性蚀刻，可以显着提高强度。本文报道的测试结果对高应力微加工结构的开发具有重要意义。在设计周期中必须考虑到机械强度对表面处理和蚀刻技术的敏感性，特别是在选择合适的制造路线时。此外，在高应力MEMS器件的设计中，重要的是要考虑材料强度的随机性。

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