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YOUNG'S MODULUS, YIELD STRENGTH AND FRACTURE STRENGTH OF MICROELEMENTS DETERMINED BY TENSILE TESTING

机译:拉伸试验确定的微量元素的杨氏模量,屈服强度和断裂强度

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摘要

Some mechanical properties of thin film microelements, e.g. fracture strength, depend on the manufacturing process, the load application as well as on size and shape of the microelements. Hence, the test structures that are used to determine mechanical properties should have dimensions of the same order of magnitude as an application structure, i.e. microelements must be used to accurately characterise MEMS. The fabrication of test structures must be realised in the same process as an intended application in order to give accurate results. Microelements are easily viewed in an SEM, but to be handled and tested in situ a micromanipulator was developed. Test structures were designed as released beams fixed to the substrate at one end, with a ring at the other. A high-precision testing unit was mounted on the micromanipulator next to the test structures. In the SEM, the testing unit was manoeuvred to grip the ring of the test structure beam and a tensile test of the beam was then executed. From the test data Young's modulus and fracture strength of polysilicon and single crystalline silicon were evaluated. Relative measurement of test structures with different beam lengths enabled Young's modulus to be evaluated with an accuracy of ±5%. Young's modulus was determined to 172±7 GPa for polysilicon and 142±9 GPa for single crystalline silicon in the <100> direction. The fracture surfaces were examined and compared. Young's modulus, yield strength and fracture strength of microelements made from electroplated nickel and nickel-iron alloy were also measured. Young's modulus was evaluated to 231±12 GPa for nickel and 155±8 GPa for nickel-iron alloy composed of 72 at% nickel and 28 at% iron.
机译:薄膜微量元素的某些机械性能断裂强度取决于制造工艺,载荷应用以及微量元素的尺寸和形状。因此,用于确定机械性能的测试结构应具有与应用结构相同数量级的尺寸,即,必须使用微量元素来精确表征MEMS。测试结构的制造必须以与预期应用相同的过程来实现,以提供准确的结果。微量元素很容易在SEM中查看,但是要在现场进行处理和测试,需要开发一种微型操纵器。将测试结构设计为释放光束,该释放光束的一端固定在基板上,另一端固定在一个环上。高精度测试单元在测试结构旁边的微型操纵器上安装。在SEM中,操纵测试单元以抓住测试结构梁的环,然后执行梁的拉伸测试。从测试数据评估了多晶硅和单晶硅的杨氏模量和断裂强度。通过对具有不同光束长度的测试结构进行相对测量,可以以±5%的精度评估杨氏模量。在<100>方向上,多晶硅的杨氏模量确定为172±7 GPa,单晶硅的杨氏模量确定为142±9 GPa。检查并比较断裂面。还测量了由电镀镍和镍铁合金制成的微量元素的杨氏模量,屈服强度和断裂强度。对于由72原子%的镍和28原子%的铁组成的镍-铁合金,杨氏模量被评估为231±12GPa,对于155-8GPa。

著录项

  • 来源
  • 会议地点 San Francisco CA(US)
  • 作者

    S. GREEK; F. ERICSON;

  • 作者单位

    Dept. of Materials Science, The Angstroem Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden;

    Dept. of Materials Science, The Angstroem Laboratory, Uppsala University, Box 534, SE-751 21 Uppsala, Sweden;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 结构;材料;
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