SIMULATION AND OPTIMIZATION OF VLSI INTERCONNECTS IN PRINTED CIRCUIT BOARDS

机译：打印电路板上VLSI互连的仿真和优化

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Interconnects in high-speed VLSI circuits and systems exhibit transmission line effects. With subnanosecond rise time, signals through the interconnects in printed circuit boards (PCB) suffer from delay, distortion, reflection, and crosstalk. Such signal integrity aspects are important factors in the electrical design of printed circuit boards. In this paper, we outline efficient techniques recently developed for addressing two specific aspects of the high-speed interconnect problem, namely, simulation and performance optimization. These techniques accommodate distributed interconnect models represented by lossy coupled transmission lines.

机译：高速VLSI电路和系统中的互连表现出传输线效应。在亚纳秒的上升时间内，通过印刷电路板（PCB）互连的信号会受到延迟，失真，反射和串扰的影响。这种信号完整性方面是印刷电路板电气设计中的重要因素。在本文中，我们概述了最近开发的用于解决高速互连问题的两个特定方面的有效技术，即仿真和性能优化。这些技术适应以有损耦合传输线为代表的分布式互连模型。

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《Microelectronic package and PCB technology》|1994年|123-128|共6页
会议地点 Beijing(CN)
作者
Qi-jun Zhang; Michel Nakhla;
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作者单位

Department of Electronics, Carleton University, Ottawa, Canada K1S 5B6;

Department of Electronics, Carleton University, Ottawa, Canada K1S 5B6;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
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专利

1. The application of neural networks to EM-based simulation and optimization of interconnects in high-speed VLSI circuits [J] . Veluswami A., Nakhla M.S. IEEE Transactions on Microwave Theory and Techniques . 1997,第5期

机译：神经网络在基于EM的VLSI高速电路互连仿真和优化中的应用
2. Instrumentation: Automated board testing: Coping with complex circuits: As printed circuit boards become harder to test due to VLSI components, automated systems and new design techniques are coming to the rescue [J] . Tulloss R.E. IEEE Spectrum . 1983,第7期

机译：仪器仪表：自动化的电路板测试：应对复杂的电路：由于VLSI组件使印刷电路板的测试变得更加困难，因此自动化系统和新的设计技术应运而生
3. Synthesis and Fabrication of Novel Polymeric/Organic Materials for Micro/Nano-scale Optical Printed Circuit Board and VLSI Photonic Integrated Circuit Application [J] . El-Hang Lee, In-Joo Chin, Yong Ku Kwon, Diffusion and Defect Data. Solid State Data, Part B. Solid State Phenomena . 2007,第1期

机译：用于微米/纳米级光学印刷电路板和VLSI光子集成电路应用的新型聚合物/有机材料的合成与制备
4. SIMULATION AND OPTIMIZATION OF VLSI INTERCONNECTS IN PRINTED CIRCUIT BOARDS [C] . International symposium on microelectronic package and PCB technology . 1994

机译：印刷电路板VLSI互连的仿真与优化
5. Modeling and design of DC power bus interconnects, segmentation, and signal via transitions in multi-layer printed circuit boards using FDTD and a mixed-potential integral equation approach with circuit extraction. [D] . Cui, Wei. 2001

机译：使用FDTD和带有电路提取的混合电位积分方程方法，对多层印刷电路板中的DC电源总线互连，分段和信号过渡进行建模和设计。
6. Optimization Studies on Recovery of Metals from Printed Circuit Board Waste [O] . P. Sivakumar, D. Prabhakaran, M. Thirumarimurugan 2018

机译：从印刷电路板废料中回收金属的优化研究
7. Special Articles: Design for Printed Circuit Boards and Its Electromagnetic Characteristics. 4. Simulation Techniques. Transmission Line Simulator for Printed Circuit Board Design. [O] . Tetsuo MIKAZUKI 1992

机译：特殊用品：印刷电路板设计及其电磁特性。 4.仿真技术。印刷电路板设计的传输线模拟器。

SIMULATION AND OPTIMIZATION OF VLSI INTERCONNECTS IN PRINTED CIRCUIT BOARDS

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