首页> 外文会议>Microelectronics Technology and Devices-SBMicro 2008 >Post-Silicidation Annealing Effects on Electrical and Structural Properties of NiPt Germanosilicide
【24h】

Post-Silicidation Annealing Effects on Electrical and Structural Properties of NiPt Germanosilicide

机译:硅化后退火对NiPt锗硅化物的电和结构性能的影响

获取原文
获取原文并翻译 | 示例

摘要

In this work NiPt germanosilicides were fabricated with 20 nm thick Ni and different Pt layer (3, 6, 9, and 12 nm thick) by rapid thermal annealing at 300 ℃, and then the post-annealing effects on these samples were investigated in the temperature range between 400 ℃ to 750 ℃. The obtained silicide samples were analyzed using several characterization techniques. Smooth and uniform Ni(Pt) monogermanosilicide films have been observed for all analyzed samples. For annealing temperatures lower than 500 ℃ the samples exhibited thermal stability with sheet resistances of 10 - 30 Ω/sq, and sheet resistance degradation for annealing temperatures of 500 ℃ and above. Structural transformation of formed silicide to Ge rich Ni(Pt)Si_(1-u)Ge_u films was found to occurs with increasing of the annealing temperature. Surface analysis revealed morphological instability of germanosilicides and strong tendency for agglomeration and mounds-like structure formation, that leads to an abrupt increase in the sheet resistance.
机译:通过300℃的快速热退火,制备了20nm厚的Ni和不同的Pt层(3,6,9和12nm厚)的NiPt锗硅化物,然后研究了这些样品的后退火效应。温度范围在400℃至750℃之间。使用几种表征技术分析获得的硅化物样品。对于所有分析的样品,均观察到了光滑均匀的Ni(Pt)单锗硅化物薄膜。对于低于500℃的退火温度,样品表现出热稳定性,薄层电阻为10-30Ω/ sq,并且在500℃以上的退火温度下,薄层电阻会降低。发现随着退火温度的升高,形成的硅化物向富Ge的Ni(Pt)Si_(1-u)Ge_u膜的结构转变发生。表面分析表明,锗硅化物的形态不稳定性以及结块和丘状结构形成的强烈趋势,这导致了薄层电阻的突然增加。

著录项

  • 来源
  • 会议地点 Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR)
  • 作者单位

    School of Electrical and Computer Engineering, University of Campinas P. Box 6101,13083-970 Campinas-SP, Brazil Center for Semiconductor Components, University of Campinas P. Box 6061,13083-870 Campinas-SP, Brazil;

    School of Electrical and Computer Engineering, University of Campinas P. Box 6101,13083-970 Campinas-SP, Brazil Center for Semiconductor Components, University of Campinas P. Box 6061,13083-870 Campinas-SP, Brazil;

    School of Electrical and Computer Engineering, University of Campinas P. Box 6101,13083-970 Campinas-SP, Brazil Center for Semiconductor Components, University of Campinas P. Box 6061,13083-870 Campinas-SP, Brazil;

    School of Electrical and Computer Engineering, University of Campinas P. Box 6101,13083-970 Campinas-SP, Brazil Center for Semiconductor Components, Universit;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路(IC);
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号