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Characterization of Plastic Packaging with Fringing Electric Field Sensors

机译：边缘电场传感器对塑料包装的表征

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摘要

Stability of plastic packaging for electronic circuits and electrical devices partially depends on moisture penetration into the bulk of the package, especially for applications in harsh environments. Therefore, a technique capable of moisture diffusion dynamics in plastics would be valuable for design, testing, and field deployment of electronic devices. This paper presents a proof of concept experiment that demonstrates the viability of using electrical impedance spectroscopy and non-stationary fringing electric field sensors to obtain a one-dimensional profile of moisture distribution in plastics and composite materials. A fixed penetration depth sensor is moved orthogonal to the surface of the sample, and the resulting profile is a spatial convolution of progressive addition of different layers of the sample. Qualitative explanation of the experimental results is given and a roadmap for future work is laid out.
机译：用于电子电路和电气设备的塑料包装的稳定性部分取决于水分渗透到包装主体中的能力，特别是在恶劣环境下的应用。因此，一种能够在塑料中动态扩散水分的技术对于电子设备的设计，测试和现场部署将非常有价值。本文提出了一个概念验证实验，证明了使用电阻抗光谱法和非平稳边缘电场传感器获得塑料和复合材料中水分分布的一维分布的可行性。固定的穿透深度传感器垂直于样品表面移动，并且所得到的轮廓是样品不同层逐渐添加的空间卷积。给出了实验结果的定性解释，并列出了未来工作的路线图。

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  • 来源
  • 会议地点 Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR)
  • 作者

    Kishore Sundara-Rajan; Abhinav Mathur; Alexander V. Mamishev;

  • 作者单位

    Sensors, Energy, and Automation Laboratory (SEAL) Department of Electrical Engineering University of Washington, Seattle, WA 98195;

    Sensors, Energy, and Automation Laboratory (SEAL) Department of Electrical Engineering University of Washington, Seattle, WA 98195;

    Sensors, Energy, and Automation Laboratory (SEAL) Department of Electrical Engineering University of Washington, Seattle, WA 98195;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
  • 关键词

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