• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Microelectronics technology and devices - SBMicro 2010 >A MULTI-PROCESS MICROFABRICATION SIMULATOR BASED ON CELLULAR AUTOMATA
【24h】

A MULTI-PROCESS MICROFABRICATION SIMULATOR BASED ON CELLULAR AUTOMATA

机译：基于细胞自动机的多过程微细化模拟器

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

The anisotropic wet etching of silicon in alkaline solutions is still a fundamental microfabrication technique in the development and fabrication of microeletromechanical systems (MEMS). Wet anisotropic etching allows one to manufacture, at a low cost, thin membranes, cantilevers and other self-sustained structures that have different degrees of freedom to perform mechanical movement. These movements are a key factor in many MEMS-based sensors and actuators. This technique can also be used to fabricate static microstructures or microsystems that are useful due to their 3D topology, like Si microtips and Si microchannels for microfluidic systems. One thing both types of microstructures have in common is the complex 3D geometry involved in the fabrication process. This geometry is related to the Si crystallographic planes and varies during the etching process. The 3D shape of the microstructure depends on the etching time (and other parameters, such as etchant and temperature) in such a complex way that it quickly becomes difficult to predict. This is one of the primary motivations to develop an anisotropic etching simulator.
机译：硅在碱性溶液中的各向异性湿法刻蚀仍然是微机电系统（MEMS）的开发和制造中的基本微制造技术。湿各向异性蚀刻允许以低成本制造具有不同自由度的薄膜，悬臂和其他自持结构来执行机械运动。这些运动是许多基于MEMS的传感器和执行器的关键因素。该技术还可用于制造由于其3D拓扑结构而有用的静态微结构或微系统，例如用于微流体系统的Si微尖端和Si微通道。两种类型的微结构的共同点是制造过程中涉及的复杂3D几何形状。这种几何形状与Si晶体平面有关，并且在蚀刻过程中会发生变化。微观结构的3D形状以一种复杂的方式取决于蚀刻时间（以及其他参数，例如蚀刻剂和温度），以至于很快变得难以预测。这是开发各向异性蚀刻模拟器的主要动机之一。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号