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A development of highly miniaturized on-chip passive components employing periodically arrayed ground structure for application to radio frequency integrated circuit (RFIC)

机译：采用周期排列的接地结构的高度小型化的片上无源元件的开发，用于射频集成电路（RFIC）

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In this paper, using a coplanar waveguide employing periodically arrayed ground structure (PAGS) on silicon substrate, highly miniaturized passive components were developed. Concretely, multi-section transformer, 90° hybrid coupler and ring hybrid coupler were highly miniaturized compared with conventional ones. The passive components showed good RF performances over broadband.

机译：在本文中，使用在硅衬底上采用周期性排列的接地结构（PAGS）的共面波导，开发了高度小型化的无源组件。具体而言，与传统的变压器相比，多段式变压器，90°混合耦合器和环形混合耦合器已高度小型化。无源元件在宽带上显示出良好的RF性能。

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《Microwave Conference Proceedings (APMC), 2011 Asia-Pacific》|2011年|p.1734- 1737|共4页
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Jeong-Gab Ju;
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中图分类微波与超高频技术;
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专利

1. Basic RF Characteristics of the Microstrip Line Employing Periodically Perforated Ground Metal and Its Application to Highly Miniaturized On-Chip Passive Components on GaAs MMIC [J] . Yun Y., Lee K.-S., Kim C.-R., IEEE Transactions on Microwave Theory and Techniques . 2006,第期

机译：采用周期性穿孔的接地金属的微带线的基本RF特性及其在GaAs MMIC上的高度小型片上无源元件中的应用
2. A highly miniaturized broadband on-chip impedance transformer employing Periodically Arrayed Ground Structure on silicon substrate for application to broadband wireless access system [J] . Jeong-Gab JUt, Young-Bae PARK, Bo-Ra JUNG, 電子情報通信学会技術研究報告 . 2010,第368期

机译：一种高度微型化的宽带片上阻抗变换器，在硅基板上采用周期性阵列接地结构，可应用于宽带无线接入系统
3. A highly miniaturized broadband on-chip impedance transformer employing Periodically Arrayed Ground Structure on silicon substrate for application to broadband wireless access system [J] . Jeong-Gab JUt, Young-Bae PARK, Bo-Ra JUNG, 電子情報通信学会技術研究報告 . 2010,第369期

机译：一种高度微型化的宽带片上阻抗变换器，在硅基板上采用周期性阵列接地结构，可应用于宽带无线接入系统
4. A development of highly miniaturized on-chip passive components employing periodically arrayed ground structure for application to radio frequency integrated circuit (RFIC) [C] . Jeong-Gab Ju Asia-Pacific Microwave Conference . 2011

机译：高度小型化的片上无源部件的开发，采用定期排列的地面结构，用于应用于射频集成电路（RFIC）
5. Low loading capacitance on-chip electrostatic discharges (ESD) protection circuits for gallium arsenide heterojunction bipolar transistor (HBT) radio frequency integrated circuits (RFIC). [D] . Ma, Yintat. 2004

机译：用于砷化镓异质结双极晶体管（HBT）射频集成电路（RFIC）的低负载电容片上静电放电（ESD）保护电路。
6. On-Chip Miniaturized Bandpass Filter Using GaAs-Based Integrated Passive Device Technology For L-Band Application [O] . Bao-Hua Zhu, Nam-Young Kim, Zhi-Ji Wang, 2019

机译：基于GaAs的集成无源器件技术的片上微型带通滤波器用于L波段应用
7. Open and Short Stubs Employing the Periodically Arrayed Grounded-strip Structure on the Silicon Substrate and Their Application to Miniaturized RF Filters on the Silicon RFIC [O] . Young Yun 2016

机译：在硅衬底上采用周期性排列的接地条结构的打开和短分部，并在硅RFIC上的小型射频过滤器应用

A development of highly miniaturized on-chip passive components employing periodically arrayed ground structure for application to radio frequency integrated circuit (RFIC)

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