Electro-magnetic interference reducing solutions for package stacking applications

机译：用于包装堆叠应用的减少电磁干扰的解决方案

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This paper discuss about System in Package (SIP) about Package on Package (POP). When the signals transmit, the staked substrate between upper and nether will cause the Electromagnetic Interference (EMI) which makes the performance of the circuit become worse. The purpose of this research is to establish a multi-board structure and use it to simulate the EMI of the POP packages. To discuss whether the EMI can be decrease efficiently by use of VIA structure.

机译：本文讨论了有关系统级封装（SIP）的有关系统级封装（POP）的信息。当信号传输时，上部和下部之间的桩基会引起电磁干扰（EMI），从而使电路性能变差。这项研究的目的是建立一个多板结构，并用它来模拟POP封装的EMI。讨论使用VIA结构是否可以有效降低EMI。

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来源
《Microwave Conference Proceedings (APMC), 2011 Asia-Pacific》|2011年|p.1027- 1030|共4页
会议地点 Melbourne(AU)
作者
Jiun-you Lu;
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作者单位

Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan;

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原文格式 PDF
正文语种 eng
中图分类微波与超高频技术;
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1. Spread spectrum clock generation for reduced electro-magnetic interference in consumer electronics devices [J] . Jang-Woo Lee, Hong-Jung Kim, Changsik Yoo Consumer Electronics, IEEE Transactions on . 2010,第2期

机译：生成扩频时钟以减少消费电子设备中的电磁干扰
2. Application of small angle neutron scattering to analyze precision nickel mesh for electro-magnetic interference shielding formed by continuous electroforming technique [J] . Kim M, Lee JY, Kwon SC, Physica, B. Condensed Matter . 2006,第2期

机译：小角中子散射在分析连续电铸技术形成的电磁干扰屏蔽用精密镍网中的应用
3. Development of a Cu/Low-$k$ Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications [J] . Zhang X., Lau J. H., Premachandran C. S., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011,第3期

机译：用于封装应用系统的铜/低-k $叠层模细间距球栅阵列（FBGA）封装的开发
4. Electro-magnetic interference reducing solutions for package stacking applications [C] . Jiun-you Lu Asia-Pacific Microwave Conference . 2011

机译：用于包装堆叠应用的电磁干扰减少解决方案
5. Electron correlation and quantum interference: Reduced scaling methods and applications to molecular electronics. [D] . Walter, Derek C. 2003

机译：电子相关性和量子干扰：减少缩放比例的方法及其在分子电子学中的应用。
6. Sstack: an R package for stacking with applications to scenarios involving sequential addition of samples and features [O] . Kevin Matlock, Raziur Rahman, Souparno Ghosh, -1

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8. Manufacturable Tri-Stack AlSb/InAs HEMT Low-Noise Amplifiers Using Wafer-Level-Packaging Technology for Light-Weight and Ultralow-Power Applications [R] . Chou, Y. C., Chang-Chien, P., Yang, J. M., 2009

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Electro-magnetic interference reducing solutions for package stacking applications

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