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首页> 外文会议>Nanomaterials by Severe Plastic Deformation IV >Susceptibility to stress corrosion cracking in ammonia of nanostructured Cu-10wtZn alloy produced by severe plastic deformation
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Susceptibility to stress corrosion cracking in ammonia of nanostructured Cu-10wtZn alloy produced by severe plastic deformation

机译：剧烈塑性变形产生的纳米结构Cu-10wt％Zn合金氨中应力腐蚀开裂的敏感性

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In this study, susceptibility to SCC of nanostructured Cu-10wt%Zn alloys, produced by equal-channel angular pressing (ECAP) was investigated under the constant stress test in ammonia vapour, which has been well-known typical environment for IGSCC of Cu-Zn alloy. Billets having diameter of 20 mm and length of 100 mm were subjected to ECAP for eight passes at room temperature to obtain structure with grain size of about 100 nm. After ECAP, some of the billets were flush-annealed in 473 K for 60 seconds to decrease excessive unequilibrium dislocations at grain boundaries. Coarse grained specimens without ECAP and one-pass specimens were also tested for comparison. The specimens for SCC were tensioned by a constant load in ammonia vapour inside a glass chamber for 24 hours at room temperature. After the SCC tests, maximum length of cracks was evaluated by SEM. Specimen having UFG structure by 8-passes exhibited cracks in lower applied stress ratio, (=σ_a/σ_(ys)) compared with 0- and 1-pass samples, where σ_a is applied stress and σ_(ys) is yield stress, respectively. Most importantly, the specimen with annealed at 473K for 60s after ECAP cracked in higher applied stress. It became less sensitive to SCC after flush annealing although mechanical properties were not changed considerably. In our previous studies, we reported that the SCC of UFG copper produced by ECAP, and the sensitivity to SCC becomes lower by flush annealing. Results are discussed in terms of grain boundary state with or without extrinsic grain boundary dislocations.
机译：在这项研究中，研究了通过等通道角压制（ECAP）在氨气中进行恒应力测试的纳米结构Cu-10wt％Zn合金对SCC的敏感性，这是众所周知的典型Cu-IGSCC环境。锌合金。将直径为20 mm，长度为100 mm的钢坯在室温下进行ECAP八次，以获得晶粒尺寸约为100 nm的组织。 ECAP之后，将某些坯料在473 K中进行平整退火60秒，以减少晶粒边界处过度的不平衡位错。还对没有ECAP的粗粒样品和单次通过样品进行了比较。在室温下，通过在玻璃室内的恒定氨气负荷将SCC样品拉紧24小时。在SCC测试之后，通过SEM评估裂缝的最大长度。与0和1道次试样相比，具有8道次UFG结构的试样在较低的施加应力比（=σ_a/σ_（ys））上出现裂纹，其中σ_a为施加应力，σ_（ys）为屈服应力。最重要的是，ECAP在较高的施加应力下破裂后，在473K退火60s。尽管机械性能没有明显变化，但在平齐退火后，它对SCC的敏感性降低。在我们以前的研究中，我们报道了ECAP生产的UFG铜的SCC，并且通过冲洗退火对SCC的敏感性降低。根据有或没有外在晶界位错的晶界状态讨论了结果。

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