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Thermopile linear array for spectroscopy applications

机译:用于光谱学应用的热电堆线性阵列

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An uncooled linear array of 66 infrared elements has been designed, simulated, and fabricated using MEMS techniques. CMOS compatible poly-Silicon thermoelectric materials are utilized. Numerical simulations optimize the geometry and physical parameters for the thermopile materials. The pixel dimensions are 2.0 mm × 0.45 mm with 0.5 mm pitch. Excellent performance has been obtained in Nitrogen environment: D~* = 1.2 × 10~8 cm (Hz)~(1/2)/W; τ = 31 ms; and cross talk of <15 %. Measured performance is comparable to, and in some respects exceeds, the performance of thermopile linear arrays based on Bi and Sb materials. The arrays are packaged for integration with an existing dispersive infrared spectrometer.
机译:已使用MEMS技术设计,模拟和制造了由66个红外元件组成的未冷却线性阵列。使用了CMOS兼容的多晶硅热电材料。数值模拟优化了热电堆材料的几何形状和物理参数。像素尺寸为2.0毫米×0.45毫米,间距为0.5毫米。在氮气环境中获得了出色的性能:D〜* = 1.2×10〜8 cm(Hz)〜(1/2)/ W; τ= 31毫秒;串扰<15%。测得的性能与基于Bi和Sb材料的热电堆线性阵列的性能相当,并且在某些方面超过了。这些阵列经过封装,可以与现有的分散红外光谱仪集成。

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