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首页> 外文会议>Photomask and Next-Generation Lithography Mask Technology XIII pt.2 >The Art of Reticle Management
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The Art of Reticle Management

机译：标线管理的艺术

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Rising complexity and density of device designs result in a tremendous increase of reticle inventory costs. Due to advanced RET solutions, reticle acquisition time and prices, as well as the data volume to be managed, increase significantly. High-energy exposure tools and new categories of progressive defects have an increasing impact on the reticle life time. New technologies, smaller feature sizes and shorter wavelengths raise challenges like haze, crystal growth and ESD. State of the art FABs have an ever-increasing amount of automation systems to run the processing steps. This requires all supporting systems to keep pace. New tool generations have very large throughput capability. So delays due to reticle availability have an even larger impact on output than previously. The real-time dispatching system needs to be able to automatically select and reserve suitable reticles to avoid exposure tool idle time. Reticles are a major fab asset and are one of the bottlenecks in achieving maximum efficiency in semiconductor manufacturing. An intelligent and fully automated reticle life cycle management is crucial to meet today's target quality and production goals at reasonable cost. All reticle data - from cradle to grave - needs to be stored in one central database to ensure consistency, performance and accuracy of data and trend analysis. The solutions described mainly result from the ramp-up at a new 300mm DRAM semiconductor facility. One of the key requirements was to fully automate the entire reticle data flow without human interaction or paper work. The given customer business rules were modeled to automatically monitor the reticle work flow. At the same time, highest flexibility was required to easily adjust the configuration to upcoming changes or improvements.
机译：器件设计的复杂性和密度不断提高，导致标线库存成本大大增加。由于采用了先进的RET解决方案，因此，光罩的获取时间和价格以及要管理的数据量都大大增加了。高能量的曝光工具和新的渐进缺陷类别对光罩寿命的影响越来越大。新技术，更小的特征尺寸和更短的波长带来了诸如雾度，晶体生长和ESD等挑战。最先进的FAB具有越来越多的自动化系统来运行处理步骤。这要求所有支持系统保持同步。新一代工具具有非常大的吞吐能力。因此，由于标线的可用性导致的延迟对输出的影响比以前更大。实时调度系统需要能够自动选择并保留适当的标线，以避免曝光工具空闲时间。标线是晶圆厂的主要资产，并且是在半导体制造中实现最大效率的瓶颈之一。智能，全自动的标线片生命周期管理对于以合理的成本满足当今的目标质量和生产目标至关重要。所有掩模版数据（从摇篮到坟墓）都需要存储在一个中央数据库中，以确保数据和趋势分析的一致性，性能和准确性。所描述的解决方案主要来自新的300mm DRAM半导体工厂的产能提升。关键要求之一是完全自动化整个标线数据流，而无需人工干预或文书工作。对给定的客户业务规则进行建模以自动监视标线工作流程。同时，需要最大的灵活性才能轻松地将配置调整为即将进行的更改或改进。

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