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首页> 外文会议>Photonic applications for aerospace, commercial, and harsh environments IV >Micro Packaging of Hermetic Seal Laser Diode Module for the Harsh Environment of Aerospace Applications
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Micro Packaging of Hermetic Seal Laser Diode Module for the Harsh Environment of Aerospace Applications

机译：航空航天严酷环境中密封激光二极管模块的微包装

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摘要

This paper describes micro soldering method of hermetic DIL (dual in line) laser diode module packaging. Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of aerospace applications. For this package a new novel technique incorporating microscope with twin micro tweezers, a CCD image captured camera as monitoring probe and preformed rings of Pb-Sn and In-Sn alloys for hermetic sealing using a micro-soldering process was developed. The procedure is able to confine the solder seal to a small region inside the ferrule near the fiber feed-through hole on the wall of the DIL package. After completing the development, which included temperature and thermal cycling and analysis showed the improved method using lead-tin alloy had no fiber damage after the micro-soldering seal. The new process resulted in 100% success in our packaging design.
机译：本文介绍了密封DIL（双列直插式）激光二极管模块封装的微焊接方法。通常，可靠，可重复生产，高产量的包装技术对于满足航空航天应用的恶劣环境的成本，性能和服务目标至关重要。对于这种包装，开发了一种新技术，该技术结合了具有双微镊子的显微镜，作为监视探针的CCD图像捕获相机以及用于使用微焊接工艺进行气密密封的Pb-Sn和In-Sn合金预制环。该程序能够将焊料密封圈限制在套圈内部靠近DIL封装壁上的光纤穿通孔的小区域内。开发完成后，包括温度和热循环，分析表明使用铅锡合金的改进方法在微焊接密封后不会损坏纤维。新工艺使我们的包装设计获得了100％的成功。

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