Summary form only give. @font-face {font-family: "Arial";}p.MsoNormal, li.MsoNormal, div. MsoNormal {margin: 0in 0in 0.0001pt; font-size: 12pt; font-family: "Times New Roman";}div. Section1 {page: Section1;}. A finite element model has been created to quantify the thermal fatigue damage of the CPV die attach. Simulations are used to compare to results of empirical thermal fatigue equations originally developed for accelerated chamber cycling. While the empirical equations show promise when extrapolated to the lower temperature cycles characterisitic of weather-induced temperature changes in the CPV die attach, it is demonstrated that their damage does not accumulate linearly: the damage a particular cycle contributes depends on the preceding cycles. Simulations of modeled CPV cell temperature histories provided for direct comparison of the FEM and empirical methods, and for calculation of equivalent times provided by standard accelerated test sequences.
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机译：摘要表格只给。 @ font-face {font-family：“ Arial”;} p.MsoNormal，li.MsoNormal，div。 MsoNormal {margin：0in 0in 0.0001pt;字体大小：12pt； font-family：“ Times New Roman”；} div。 Section1 {page：Section1;}。已经创建了一个有限元模型来量化CPV芯片附着的热疲劳损伤。模拟用于与最初为加速室循环开发的经验热疲劳方程式的结果进行比较。虽然经验方程式显示了当推算到CPV芯片连接中天气引起的温度变化特征的较低温度循环时的希望，但已证明它们的损害不是线性累积的：特定循环的损害取决于先前的循环。建模的CPV电池温度历史记录的仿真可用于FEM和经验方法的直接比较，以及用于计算标准加速测试序列提供的等效时间。
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