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首页> 外文会议>Powder Metallurgy World Congress amp; Exhibition(PM 2006); 20060924-28; Busan(KR) >Fabrication of TFA-MOD YBCO Films Using the Y_2Ba_1Cu_1O_x and Ba_3Cu_5O_8 Powders
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Fabrication of TFA-MOD YBCO Films Using the Y_2Ba_1Cu_1O_x and Ba_3Cu_5O_8 Powders

机译：使用Y_2Ba_1Cu_1O_x和Ba_3Cu_5O_8粉末制造TFA-MOD YBCO薄膜

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摘要

We fabricated YBCO film using a TFA-MOD method and evaluated the phase formation, texture evolution, and critical properties as a function of the firing temperatures. In order to enhance the reaction kinetics and to control the formation of the second phases, Y_2Ba_1CuiO_x and Ba_3Cu_5O_8 powders were used as precursors (the so called "211 process"), instead of Y-, Ba-, and Cu-based acetate, and dissolved in trifluoroacetic acid (TFA). The films were calcined at 460℃ and then fired at 750℃-800℃ in a 12.1% humidified Ar-O_2 atmosphere. We found that the microstructure varied significantly with the firing temperature; the grain grew further and the film became denser as the firing temperature increased. The textures of all of the films were similar and mainly biaxial. On the other hand, the intensity of the major and minor texture components differed from each other. For the film fired at 775 ℃, the critical current was obtained to be 39 A/cm-width (corresponding critical current density is 2.0 MA/cm~2 ), which was probably attributed to such factors as the enhanced phase purity and out-of-plane texture, the moderate film density and grain size, and crack-free surface.
机译：我们使用TFA-MOD方法制作了YBCO膜，并评估了相形成，织构演变和临界性质随烧结温度的变化。为了增强反应动力学并控制第二相的形成，使用Y_2Ba_1CuiO_x和Ba_3Cu_5O_8粉末代替Y-，Ba-和Cu基醋酸盐作为前体（所谓的“ 211工艺”），溶于三氟乙酸（TFA）。将薄膜在460℃下煅烧，然后在12.1％的湿润Ar-O_2气氛中在750℃-800℃煅烧。我们发现，微观结构随烧成温度的变化而变化；随着烧成温度的升高，晶粒进一步长大，薄膜变得更致密。所有薄膜的纹理都是相似的，并且主要是双轴的。另一方面，主要和次要纹理成分的强度彼此不同。对于在775℃烧成的薄膜，临界电流为39 A / cm宽（对应的临界电流密度为2.0 MA / cm〜2），这可能归因于相纯度提高和析出率降低。平面纹理，适中的薄膜密度和晶粒尺寸以及无裂纹的表面。

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