COST Action MP0602: High Temperature Lead-Free Solders (HISOLD)

机译：COST Action MP0602：高温无铅焊料（HISOLD）

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

The paper describes the COST Action MP0602, which was established to seek lead-free replacements for high melting temperature solders (T_m >230℃) used in High Intensity Discharge lamps and printed circuit boards for various types of light sources.

机译：本文介绍了COST Action MP0602，它旨在寻求用于高强度放电灯和各种光源的印刷电路板的高熔点焊料（T_m> 230℃）的无铅替代品。

著录项

来源
《Proceedings of the 12th international symposium on the science and technology of light sources and the 3rd international conference on white LEDs and solid state lighting》|2010年|p.223-224|共2页
会议地点 Eindhoven(NL);Eindhoven(NL);Eindhoven(NL);Eindhoven(NL)
作者
S.A. Mucklejohn; Z. Toth; N.Hoo;
展开▼
作者单位

Ceravision Limited, The Mansion, Bletchley Park, Buckinghamshire MK3 6EB, UK;

rn GE Hungary, Vaci ut 77, Budapest, H-I044, Hungary;

ITR1, Unit 3, Curo Park, Frogmore, St.Albans, Hertfordshire AL2 2DD, UK;

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类电气照明;
关键词

相似文献

外文文献
中文文献
专利

1. Technology in New Institutional Economics --Comparison of Transaction Costs in Schumpeter＇s Capitalist Development Ideology [J] . Ilkben Akansel 中国经济评论：英文版 . 2016,第002期
2. Transaction Costs in Global Ecology Policy-Making [J] . Jan-Erik Lane 中国经济评论：英文版 . 2015,第003期
3. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering [J] . Kroupa A., Dinsdale A., Watson A., Journal of Mining and Metallurgy, Section B: Metallurgy . 2012,第3期

机译：用于高温无铅焊接的材料的热力学数据库COST MP0602
4. European COST Action 531: Basic Lead-free Soldering Research [J] . TIN World . 2007,第17期

机译：欧洲COST行动531：基本无铅焊接研究
5. European cost action 531: Basic research on lead-free soldering [J] . Ipser H. Journal of Mining and Metallurgy, Section B: Metallurgy . 2007,第2期

机译：欧洲成本行动531：无铅焊接的基础研究
6. HISOLD 4P Qon6;R, COST project for solder material innovations and solder joint properties assessment [C] . Plotog I., Svasta P., Villain J., Design and Technology of Electronics Packages, (SIITME 2009) . 2009

机译：HISOLD 4P Qon6; R，COST项目，用于焊料材料创新和焊点性能评估
7. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016

机译：低温SNBI焊膏的工艺，强度和微观结构分析混合无铅焊球
8. Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders [O] . Tomi Laurila, Vesa Vuorinen 2009

机译：镍金属化与各种无铅焊料之间界面反应的热力学动力学综合分析
9. The thermodynamic database COST MP0602 for materials for high-temperature lead-free soldering [O] . Kroupa A., Dinsdale A., Watson A., 2012

机译：用于高温无铅焊接的材料的热力学数据库COST MP0602
10. AgSn-Based Solder Alloys and Solder/Conductor Interactions in Lead-Free Electronics [R] . Korhonen, T. M. 2001

机译：基于agsn的焊料合金和无铅电子器件中的焊料/导体相互作用

COST Action MP0602: High Temperature Lead-Free Solders (HISOLD)

摘要

著录项

相似文献

相关主题

期刊订阅