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Two-Step Deposition Method for Improvement of the Electrical Characteristics of BST Thin Films

机译:改善BST薄膜电学特性的两步沉积方法

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The characteristics of the BST thin films deposited by two-step deposition process wre investigated. A 100 A thick bottom layer was deposited at 600 deg C then upper main layer was in-situ deposited at 350 deg C by rf magnetron co-sputtering, respectively. Two-step deposited BST thin film of 500 A showed lower leadkage current density of 2*10~(-8)A/cm~2 at 1.5V and more wide flat region in the low field than those of BST thin film deposited by one step process, and small silicon oxide equivalent thickness of 4.9A. With the decrease of film thickness, equivalent oxide thickness which is about 5.4A for the film with thickness of 1000A can be reduced to 4.2A for 200A.
机译:研究了通过两步沉积工艺沉积的BST薄膜的特性。在600摄氏度下沉积100 A厚的底层,然后通过射频磁控管共溅射在350摄氏度下原位沉积上主层。两步沉积的500 A的BST薄膜在1.5V电压下的引线电流密度较低,为2 * 10〜(-8)A / cm〜2,在低场中的平坦区域比通过一次沉积的BST薄膜更大。步骤工艺,和小的氧化硅等效厚度为4.9A。随着膜厚度的减小,对于厚度为1000A的膜,等效氧化物厚度约为5.4A,而对于200A,则可以减小至4.2A。

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