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A High Performance 0.18#mu#m CMOS Technology Designed for Manufactruability

机译:专为可制造性而设计的高性能0.18#μ#m CMOS技术

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摘要

A 1.8V high performance 0.18#mu#m gate length CMOS technology with polysilicon encapsulated LOCOS, double implanted twin wells, 4.5nm gate oxide thicknewss, dual amorphous silicon gate, NMOS transistors with LDD and PMOS transistors with HDD only, is presented. Drive currents of 500 #mu#A/#mu#m at V_D=V_G=1.8V for NMOS and 220 #mu#A/#mu#m for PMOS, with leakage currents at V_D=2.0V of 1 nA/#mu#m (NMOS) and 600 PA/#mu#m (PMOS), are attained. Good performance of LOCOS-based lateral isolation is demonstrated by leakage currents lower than 100fA/#mu#m-width for 0.4#mu#m n~*-n~+ spacing. An unloaded ring oscillator delay time of 30 ps/stage at 1.8V is obtained.
机译:提出了一种1.8V高性能0.18#μm栅极长度CMOS技术,该技术采用多晶硅封装的LOCOS,双注入双阱,4.5nm栅极氧化层厚新闻,双非晶硅栅极,仅具有LDD的NMOS晶体管和仅具有HDD的PMOS晶体管。 NMOS的V_D = V_G = 1.8V时的驱动电流为500#mu#A /#mu#m,PMOS的驱动电流为220#mu#A /#mu#m,而V_D = 2.0V时的泄漏电流为1 nA /#mu达到#m(NMOS)和600 PA /#mu#m(PMOS)。对于0.4#mu#m n〜* -n〜+间距,泄漏电流低于100fA /#mu#m宽度,证明了基于LOCOS的横向隔离性能良好。在1.8V时,可获得30 ps /级的空载环形振荡器延迟时间。

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