首页> 外文会议>Proceedings vol.2004-05; International Symposium on High Purity Silicon and Meeting of the Electrochemical Society; 20041003-08; Honolulu,HI(US) >Temperature Influence on the Generation Lifetime Determination Based on Drain Current Transients in Partially Depleted SOI nMOSFETs
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Temperature Influence on the Generation Lifetime Determination Based on Drain Current Transients in Partially Depleted SOI nMOSFETs

机译:温度对部分耗尽SOI nMOSFET中基于漏电流瞬变的发电寿命确定的影响

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This paper presents an analysis of the temperature influence on the generation lifetime determination using drain current transients in floating body partially SOI nMOSFETs fabricated with a 0.13 μm SOI CMOS technology. The device parameters used to calculate the generation lifetime are studied as a function of the temperature from 20 ℃ to 80℃ and the maximum influence is found to be about 13%. A sensitivity analysis is done in function of the gate oxide thickness and silicon film concentration and in the worst case the influence on the generation lifetime determination is found to be around 17%. Considering that for many applications these changes can be neglected, a simple method to estimate the generation lifetime is proposed. The method is experimentally applied and the maximum error is found to be in the range of 6 %.
机译:本文使用0.13μmSOI CMOS技术制造的浮体部分SOI nMOSFET中的漏极电流瞬变,对温度对确定寿命的影响进行了分析。研究了用于计算发电寿命的设备参数与20℃至80℃温度之间的函数关系,发现最大影响约为13%。根据栅极氧化层厚度和硅膜浓度进行灵敏度分析,在最坏的情况下,发现对寿命确定的影响约为17%。考虑到对于许多应用而言,这些变化可以忽略不计,因此提出了一种估算发电寿命的简单方法。该方法已通过实验应用,发现最大误差为6%。

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