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首页> 外文会议>Proceedings vol.2004-17; Electrochemical Society(ECS) Meeting and Symposium on Electrochemical Process in ULSI and MEMS; 2004 Spring; San Antonio,TX(US) >A COMPARISON STUDY OF MPSA-Cl-PEG AND SPS-Cl-PEG ADDITIVE SYSTEMS FOR COPPER ELECTRODEPOSITION
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A COMPARISON STUDY OF MPSA-Cl-PEG AND SPS-Cl-PEG ADDITIVE SYSTEMS FOR COPPER ELECTRODEPOSITION

机译：MPSA-Cl-PEG和SPS-Cl-PEG铜电镀添加剂体系的比较研究

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摘要

This paper documents an experimental study to compare the behavior of SPS-Cl-PEG and MPSA-Cl-PEG additive systems during copper electrodeposition. Both similarities and differences were found in plating solutions containing one (SPS or MPSA), two (SPS-Cl or MPSA-Cl), or three (SPS-Cl-PEQ or MPSA-Cl-PEG) additives. SPS and MPSA both inhibited the copper deposition when present alone, accelerated copper deposition when present with Cl~-, and caused a slow transition from a low to a high level of acceleration in the presence of both Cl~- and PEG. The concentration required to produce a similar effect was much lower for MPSA than for SPS. In addition, the potential dependency of SPS-Cl-PEG system was much stronger than that of MPSA-Cl-PEG system. The results of this study provide insights into the mechanism governing copper superfilling for these additive systems.
机译：本文进行了一项实验研究，以比较SPS-Cl-PEG和MPSA-Cl-PEG添加剂体系在铜电沉积过程中的行为。在含有一种（SPS或MPSA），两种（SPS-Cl或MPSA-Cl）或三种（SPS-Cl-PEQ或MPSA-Cl-PEG）添加剂的镀液中发现了相似点和不同点。当单独存在时，SPS和MPSA都抑制了铜的沉积，当存在Cl〜-时，它们抑制了铜的沉积，并且在同时存在Cl〜-和PEG的情况下，引起了从低到高加速度的缓慢转变。 MPSA产生类似效果所需的浓度远低于SPS。另外，SPS-Cl-PEG系统的潜在依赖性比MPSA-Cl-PEG系统的潜在依赖性强得多。这项研究的结果为这些添加剂体系的铜超填充机理提供了见解。

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