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首页> 外文会议>Proceedings vol.2004-17; Electrochemical Society(ECS) Meeting and Symposium on Electrochemical Process in ULSI and MEMS; 2004 Spring; San Antonio,TX(US) >A COMPARATIVE STUDY OF SLURRY FLOW AND TRANSPORT IN CMP POLISHING PADS OF THREE GROOVE ARRAYS
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A COMPARATIVE STUDY OF SLURRY FLOW AND TRANSPORT IN CMP POLISHING PADS OF THREE GROOVE ARRAYS

机译：三种沟槽CMP抛光板淤泥流动与输送的比较研究。

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摘要

Grooves play a key role in CMP slurry fluid mechanics, heat and polish debris removal, and mixing of fresh and spent chemistries. An experiment was developed using porous-media fluid mechanics to quantify the fluid flow resistance in the pad asperity layer relative to the grooves. New pad descriptors were obtained with which a 3-D fluid flow model was built of the full pad-wafer gap of a dual-axis polisher. Slurry motion was studied in concentric circular, XY grid, and radial grooves relative to adjacent texture areas and found in all cases to depart strongly from the direction of platen rotation. Resolved at groove scale, transient slurry mixing profiles in the pad-wafer gap showed trailing wakes in the grooves having a length dependent on the local orientation of the pad and wafer velocity vectors. Circular grooves created steady-state mixing patterns under the wafer, whereas XY and radial grooves induced cyclic mixing dynamics.
机译：沟槽在CMP浆料流体力学，热和抛光碎屑的去除以及新鲜化学物质和废化学物质的混合中起着关键作用。使用多孔介质流体力学进行了一项实验，以量化相对于凹槽的垫粗糙层中的流体流动阻力。获得了新的抛光垫描述符，利用该描述符建立了双轴抛光机的整个抛光垫-晶圆间隙的3-D流体模型。研究了在同心圆，XY网格和相对于相邻纹理区域的径向凹槽中的浆液运动，发现在所有情况下浆液运动都强烈偏离压板旋转方向。在沟槽尺度上解析，在垫-晶片间隙中的瞬时浆料混合分布显示出在沟槽中的尾随尾流，其长度取决于垫的局部取向和晶片速度矢量。圆形凹槽在晶片下方创建了稳态混合模式，而XY凹槽和径向凹槽则引起了循环混合动力学。

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