SU-8 LOW CONTRAST PROCESS FOR MULTI-LEVEL E-BEAM LITHOGRAPHY

机译：多级电子束光刻的SU-8低对比度工艺

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This work shows the development of a low contrast lithographic process for multi-level lithography using the negative tone chemically amplified photoresist SU-8 - usually employed in high aspect ratio structures, I. E., high contrast processing. An electron beam lithography system is used and multilevel topographic structures are obtained. Due to its mechanical and optical properties, with the aid of accurate processing, SU-8 resist is especially suitable for versatile direct write systems, aiming the fabrication of multilevel and/or continuous-relief micro-optical elements such as Fresnel lenses.

机译：这项工作显示了使用负性化学放大的光刻胶SU-8进行多级光刻的低对比度光刻工艺的发展-通常用于高纵横比结构，即高对比度处理。使用电子束光刻系统，并获得多层形貌结构。由于SU-8抗蚀剂的机械和光学特性，在精确加工的帮助下，它特别适用于多功能直接写入系统，旨在制造多级和/或连续浮雕微光学元件，例如菲涅耳透镜。

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《Proceedings vol.2005-08; International Symposium on Microelectronics Technology and Devices(SBMICRO 2005); 200509;》|2005年|P.219-225|共7页
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作者
R. T. Catelli; A.C. Seabra;
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LSI-PSI-EPUSP - Universidade de Sao Paulo, Av. Prof. Luciano Gualberto, trav.3, 158 05508-900 - Sao Paulo - SP, Brazil;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
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1. An optimal high contrast e-beam lithography process for the patterning of dense fin networks [J] . F. Fruleux-Cornu, J. Penaud, E. Dubois, Materials science & engineering. C, Biomimetic and supramolecular systems . 2006,第5a7期

机译：用于密集鳍状网络构图的最佳高对比度电子束光刻工艺
2. Hybrid lithography: The marriage between optical and e-beam lithography. A method to study process integration and device performance for advanced device nodes [J] . Steven Steen, Sharee J. McNab, Lidija Sekaric, Microelectronic Engineering . 2006,第4a9期

机译：混合光刻：光学和电子束光刻的结合。研究高级设备节点的过程集成和设备性能的方法
3. Processing study of SU-8 pillar profiles with high aspect ratio by electron-beam lithography [J] . Ma Yaqi, Xia Yifan, Liu Jianpeng, Microelectronic Engineering . 2016,第JANa期

机译：电子束光刻技术研究高长宽比的SU-8柱型材
4. SU-8 LOW CONTRAST PROCESS FOR MULTI-LEVEL E-BEAM LITHOGRAPHY [C] . R. T. Catelli, A. C. Seabra International Symposium on Microelectronics Technology and Devices . 2005

机译：SU-8多级电子束光刻的低对比度过程
5. Electromigration enhanced kinetics of copper-tin intermetallic compounds in lead-free solder joints and copper low-k dual damascene processing using step and flash imprint lithography. [D] . Chao, Huang-Lin. 2009

机译：电迁移增强了无铅焊点中铜-锡金属间化合物的动力学，并使用分步和闪光压印光刻技术进行了铜低k双大马士革工艺。
6. Single-Mode Tapered Vertical SU-8 Waveguide Fabricated by E-Beam Lithography for Analyte Sensing [O] . Yu Xin, Gregory Pandraud, Yongmeng Zhang, 2019

机译：电子束光刻技术制作的单模锥形垂直SU-8波导用于分析物传感
7. CSAR 62 as negative-tone resist for high-contrast e-beam lithography at temperatures between 4 K and room temperature [O] . Kaganskiy, Arsenty, Heuser, Tobias, Schmidt, Ronny, 2016

机译：CsaR 62作为高对比度电子束光刻的负色调抗蚀剂温度在4 K和室温之间
8. E-Beam Lithography for Half Micrometer Processing [R] . Lerme, M. , Guegan, G. , Dal'zotto, B. 1987

机译：用于半微米加工的电子束光刻

SU-8 LOW CONTRAST PROCESS FOR MULTI-LEVEL E-BEAM LITHOGRAPHY

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