FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

机译：流体自组装系统集成

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We demonstrate the use of fluidic self-assembly for the integration of freestanding microfabricated single crystal silicon circuit components onto clear, flexible plastic substrates. The use of self-assembly allows for integration of devices and substrates that are made in incompatible microfabrication technologies into a single platform. Shape recognition between prescribed binding sites on the plastic substrate and silicon components allows for preferential part-to-substrate self-assembly. The self-assembly is driven by gravity, fluid dynamics, and the capillary forces of a molten alloy.

机译：我们演示了使用流体自组装将独立式微细加工的单晶硅电路组件集成到透明，柔软的塑料基板上。自组装的使用允许将以不兼容的微加工技术制造的设备和基板集成到单个平台中。塑料基板上规定的结合位点与硅组件之间的形状识别允许优先进行零件到基板的自组装。自组装由重力，流体动力学和熔融合金的毛细作用力驱动。

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《Proceedings vol.2005-08; International Symposium on Microelectronics Technology and Devices(SBMICRO 2005); 200509;》|2005年|P.429-435|共7页
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Sean A. Stauth; Babak A. Parviz;
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Department of Electrical Engineering University of Washington P.O. Box 352500 Paul Allen Center, Seattle, WA, 98103, USA;

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原文格式 PDF
正文语种 eng
中图分类微电子学、集成电路（IC）;
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1. Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles [J] . Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Advanced Materials . 2005,第20期

机译：使用粒子的自组装，传递和积分来缩小自组装和微系统之间的差距
2. Heterogeneous Integration of Thin-Film Optical Devices Utilizing Fluidic Self-Assembly and Micro-Pick-and-Place Technique [J] . Jing Xiao, Ritesh Ray Chaudhuri, Sang-Woo Seo Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2016,第8期

机译：利用流体自组装和微拾取放置技术的薄膜光学器件异构集成
3. Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques [J] . Y. A. Chapuis, A. Debray, L. Jalabert, Journal of Micromechanics and Microengineering . 2009,第10期

机译：使用流体自组装技术进行3D MEMS-IC集成的替代方法
4. FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION [C] . Sean A. Stauth, Babak A. Parviz International Symposium on Microelectronics Technology and Devices . 2005

机译：用于系统集成的流体自组装
5. Fluidic assisted thin-film device heterogeneous integration and its applications in photonic integrated systems [D] . Xiao, Jing 2013

机译：流体辅助薄膜器件的异质集成及其在光子集成系统中的应用
6. Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration [O] . Takafumi Fukushima, Hideto Hashiguchi, Hiroshi Yonekura, 2016

机译：带有毛细管自组装的氧化物-氧化物热压直接键合技术用于多芯片至晶圆异质3D系统集成
7. Packaging of Microfluidic systems: A microfluidic Motherboard Integrating Fluidic and Optical Interconnections [O] . Perozziello Gerardo 2008

机译：微流体系统的封装：集成流体和光学互连的微流体主板

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

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