Addition of PEG-Thiol to Cu Electroless Plating Bath for Realizing Perfect Conformal Deposition in Through-Si Via Holes for 3-D Integration

著录项

• 来源
  《Processing, materials, and integration of damascene and 3D interconnects》|2009年|p.31-36|共6页
• 会议地点 Vienna(AT);Vienna(AT)
• 作者

  F. Inoue; T. Yokoyama; S. Tanaka; K. Yamamoto; S. Shingubara;

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• 作者单位

  Department of Mechanical Engineering, Kansai University, 3-3-35 Yamate-Cho, Suita, Osaka, Japan;

  Department of Mechanical Engineering, Kansai University, 3-3-35 Yamate-Cho, Suita, Osaka, Japan;

  National Institute of Communication Technology, 588-2 Iwaoka, Nishi-Ku, Kobe, Hyogo, Japan;

  National Institute of Communication Technology, 588-2 Iwaoka, Nishi-Ku, Kobe, Hyogo, Japan;

  Department of Mechanical Engineering, Kansai University, 3-3-35 Yamate-Cho, Suita, Osaka, Japan;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 半导体技术;
• 关键词