Micro-optic and microelectronic integrated packaging of vertical-cavity lasers

机译：垂直腔激光器的微光和微电子集成包装

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Abstract: lications for optoelectronic integrated circuits demand high performance optoelectronic devices or smart pixels. The stringent requirements on these smart pixels require that packaging technology be developed concurrently to the development of the optoelectronic components. We discuss the packaging requirements of smart pixels based on vertical-cavity microlasers. We present a novel microlens/macrolens combination which allows high power densities to be focused to a diffraction- limited spot using present VCSEL technology. Finally, we discuss the applications for microlaser-based spatial light source arrays. !19

机译：摘要：光电集成电路的应用需要高性能的光电设备或智能像素。这些智能像素的严格要求要求在开发光电组件的同时开发封装技术。我们讨论了基于垂直腔微激光器的智能像素的封装要求。我们提出了一种新颖的微透镜/微透镜组合，该组合允许使用当前的VCSEL技术将高功率密度聚焦到衍射极限点。最后，我们讨论基于微激光的空间光源阵列的应用。！19

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《Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices》|1993年|p.97-105|共9页
会议地点 Los Angeles CA(US)
作者
Greg R. Olbright; Photonics Research; Inc.; Boulder; CO; USA; Jack L. Jewell; Photonics Research; Inc.; Boulder; CO; USA; Robert P. Bryan; Photonics Research; Inc.; Boulder; CO; USA; Winston S. Fu; Photonics Research; Inc.; Longmont; CO; USA.;
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正文语种 eng
中图分类无线电电子学、电信技术;
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1. Precise etch-depth control of microlens-integrated intracavity contacted vertical-cavity surface-emitting lasers by in-situ laser reflectometry and reflectivity modeling [J] . Y.M. Song, K.S. Chang, B.H. Na, Thin Solid Films . 2009,第19期

机译：通过原位激光反射法和反射率建模精确控制微透镜集成腔内接触垂直腔面发射激光器的蚀刻深度
2. High-power vertical-cavity surface-emitting lasers bonded with efficient packaging [J] . 晏长岭, 路国光, 秦莉中国光学快报：英文版 . 2010,第006期

机译：高功率垂直腔面发射激光器，结合有效封装
3. Sio_x-planarized And Transistor Outlook-packaged Oxide-confined Vertical-cavity Surface-emitting Lasers With Ring-shape Geometry For High-speed (10 Gb/s) Operation [J] . Chia-Lung Tsai, Jia-Qing Lin, Feng-Ming Lee, Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures . 2009,第1期

机译：具有环形几何形状且高速（10 Gb / s）运行的Sio_x平面和晶体管封装的氧化物封装的垂直腔面发射激光器，具有环形几何形状
4. Micro-optic and microelectronic integrated packaging of vertical-cavity lasers [C] . Greg R. Olbright, Jack L. Jewell, Robert P. Bryan, Conference on processing and packaging of semiconductor lasers and optoelectronic devices . 1993

机译：垂直腔激光器的微光学和微电子集成包装
5. Monolithically integrated vertical-cavity lasers and resonant detectors for free-space optical interconnects. [D] . Louderback, Duane Alan. 2003

机译：用于自由空间光学互连的单片集成垂直腔激光器和谐振检测器。
6. Integrated plasmonic circuitry on a vertical-cavity surface-emitting semiconductor laser platform [O] . Cillian P. T. McPolin, Jean-Sebastien Bouillard, Sebastien Vilain, -1

机译：垂直腔表面发射半导体激光器平台上的集成等离子体电路
7. Integrated optical vortex vertical-cavity surface-emitting lasers [O] . Li Huanlu, Phillips David B., Wang Xuyang, 2015

机译：集成光学涡流垂直腔面发射激光器
8. Materials and Device Research for High-Speed Integrated OptoelectronicTransmitters Using Vertical-Cavity Surface-Emitting Lasers [R] . Dupuis, R. D. 1996

机译：使用垂直腔面发射激光器的高速集成光电发射器的材料和器件研究

Micro-optic and microelectronic integrated packaging of vertical-cavity lasers

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