【24h】

Development of a Model for Predicting Dry Stiction in Microelectromechanical Systems (MEMS)

机译:微机电系统(MEMS)的干摩擦预测模型的开发

获取原文

摘要

Adhesion between micro parts, also referred to as stiction, is a major failure mode in MEMS. Undesirable stiction, which results from contact between surfaces, can severely compromise the reliability of MEMS. In this paper, a model is developed to predict the dry stiction between uncharged micro parts in MEMS. In dry stiction, the interacting surfaces are assumed to be either hydrophobic or placed in dry environment. In this condition, the van der Waals (vdW) and asperity deformation forces are dominant. Here, a model is developed for the vdW force between rough micro surfaces and the new model is combined with a newly developed multiple asperity point model for the elastic/plastic deformation of rough surfaces in contact to solve for the equilibrium condition of the forces. This, in turn, will yield the equilibrium distance between micro surfaces, using which the apparent work of adhesion can be found. The result of the theory is compared with the available experimental data from literature. The developed model can be easily used for design purpose. If the topographic data and material constants are known, the adhesion parameters can be quickly calculated using the model.
机译:微型零件之间的粘合(也称为粘着)是MEMS中的主要失效模式。由于表面之间的接触而产生的不希望的摩擦会严重损害MEMS的可靠性。在本文中,开发了一个模型来预测MEMS中不带电的微零件之间的干静摩擦。在干式静摩擦中,相互作用的表面被假定为疏水性或置于干燥环境中。在这种情况下,范德华力(vdW)和粗糙变形力占主导。在此,针对粗糙的微表面之间的vdW力开发了一个模型,并将新模型与新开发的用于接触的粗糙表面的弹性/塑性变形的多凹凸点模型相结合,以解决力的平衡条件。反过来,这将产生微表面之间的平衡距离,利用该平衡距离可以发现表观的粘附力。将该理论的结果与文献中可获得的实验数据进行了比较。开发的模型可以轻松用于设计目的。如果已知地形数据和材料常数,则可以使用该模型快速计算粘合参数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号