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首页> 外文会议>Second International Symposium on Adhesive Joints: Formation, Characteristics and Testing Vol.2 May 22-24, 2000 Newark, New Jersey >Ultrasonic evaluation of adhesive joints: An overview
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Ultrasonic evaluation of adhesive joints: An overview

机译：胶粘接头的超声波评估：概述

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摘要

A number of different ultrasonic nondestructive evaluation techniques have been applied to adhesive joint inspection for decades. Great success has been obtained for delamination detection and cohesive strength determination. Interfacial strength or interfacial weakness evaluation, on the other hand, has been difficult to carry out. Some success has been attained for specific material and manufacturing systems. In this paper a description of the literature and current procedures to evaluate adhesive joint integrity are presented. Such topics as modeling aspects, (piezoelectric piezocomposites, and electromagnetic acoustic transducer potential), guided waves, focused beam techniques, "C" scan techniques, high and low frequency aspects, pulse echo and through-transmission testing, oblique incidence, longitudinal and shear wave aspects, pattern recognition and neural net utilitization, "kissing bonds", composite patch bonding, and quadrature phase detection are discussed. Future direction is also outlined including, for example, a comb transducer phase velocity-frequency tuning approach with guided waves.
机译：数十年来，许多不同的超声非破坏性评估技术已应用于粘合剂接头检查。分层检测和内聚强度测定已获得巨大成功。另一方面，很难进行界面强度或界面缺陷评估。对于特定的材料和制造系统，已经取得了一些成功。在本文中，介绍了文献和评估胶接接头完整性的当前程序。诸如建模方面（压电复合材料和电磁声换能器电势），导波，聚焦束技术，“ C”扫描技术，高频和低频方面，脉冲回波和直通测试，斜入射，纵向和剪切等主题讨论了波形方面，模式识别和神经网络利用，“亲吻键”，复合膜片键合和正交相位检测。还概述了未来的方向，包括例如带有导波的梳状换能器相速度-频率调谐方法。

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