首页> 外文会议>SEM IX International Congress on Experimental Mechanics June 5-8, 2000 Orlando, Florida >Mechanics of Polymer/Metal Interfaces in Microelectronic Packaging
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Mechanics of Polymer/Metal Interfaces in Microelectronic Packaging

机译:微电子封装中聚合物/金属界面的力学

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The loss of interfacial adhesion is mostly seen in the failure of adhesive joints. The interfacial adhesion strength is believed to highly depend on a number of parameters, such as surface topology and treatment, adhesive chemistry/structure, rheological properties of the aolids, and elastic mismatch across the interface. Thermal mismatch between polymer adhesive and adherend also has considerable effect on adhesion. Surface science provides modern tools to quantify the thermodynamic work of adhesion (microscopic adhesion energy) through surface contact angle measurement, while fracture emchanics enables the measurement of the interfacial fracture toughness (macroscopic energy density) through various experimental techniques. The objectives of this work are (i) to understand how the thermodynamic work of adhesion is related to the fracture toughness, and (ii) what and how other factors (crack tip plasticity, surface roughness, residual stresses, etc.) affect the fracture toughness.
机译:界面粘合力的损失主要出现在粘合接头的失效中。据信界面粘合强度高度取决于许多参数,例如表面拓扑和处理,粘合剂化学/结构,丙烯酸的流变性和跨界面的弹性失配。聚合物粘合剂和被粘物之间的热失配也会对粘合产生很大影响。表面科学提供了现代化的工具,可通过测量表面接触角来量化粘合的热力学功(微观粘合能),而断裂力学则可以通过各种实验技术来测量界面断裂韧性(宏观能量密度)。这项工作的目的是(i)了解粘合的热力学作用如何与断裂韧性相关;以及(ii)其他因素(裂纹尖端塑性,表面粗糙度,残余应力等)对断裂的影响以及影响方式和方式韧性。

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