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Simulation of SiGe Epitaxial Growth for RF-Bipolar Transistors

机译:射频双极晶体管SiGe外延生长的仿真

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A simple simulation model for the in-situ doped chemical vapor deposition of Si_(1-x)Ge_x-epitaxial layers is presented that enables the calculation of the germanium and base doping profiles of modern rf-bipolar transistors from the process recipe, i.e. gas flows, deposition time and temperature. A first approach is based on the interpolation of experimental data characterizing the CVD-equipment. Although this gives already very good results for slowly varying GeH_4-flows, abrupt turn-offs of the gas flow result in too steep profiles as compared to experiments. An extension of the model is presented that solves this problem via the introduction of a germanium surface layer that feeds a slowly decaying germanium concentration in the deposited silicon even after the germane flow has been turned off.
机译:提出了Si_(1-x)Ge_x-外延层原位掺杂化学气相沉积的简单仿真模型,该模型能够根据工艺配方(即气体)计算现代射频双极晶体管的锗和基本掺杂分布流量,沉积时间和温度。第一种方法基于表征CVD设备的实验数据的内插。尽管对于缓慢变化的GeH_4流量已经给出了很好的结果,但是与实验相比,突然关闭气流会导致轮廓过于陡峭。提出了该模型的扩展,该模型的扩展通过引入锗表面层解决了该问题,该表面层甚至在锗烷流已关闭之后,仍可在沉积的硅中提供缓慢衰减的锗浓度。

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