Thermal Modeling and Performance of LED Packaging for Illuminating Device

机译：照明设备LED封装的热建模和性能

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A three-dimensional thermal model of LED illuminating device is established by using the finite element method. The natural convective boundaries are applied on the lateral surfaces, and an equivalent convective boundary on the bottom surface is utilized to represent the real effects of heat sinks or fins on LEDs. In this paper, the dielectric layer of LED die bonding is discussed and the influences of external and internal thermal resistances are analyzed. When we enhance the external convective effect, the external thermal resistance is reduced obviously. The thermal conductivity of material and the thickness of dielectric layer are important factors on the internal thermal resistance. We may propose these results to design and develop the global principle for the heat-dissipating package of LED device to increase the performance of LED.

机译：采用有限元方法建立了LED照明装置的三维热模型。自然对流边界应用在侧面上，底面上的等效对流边界用于表示散热器或散热片对LED的实际影响。本文讨论了LED芯片键合的介电层，并分析了外部和内部热阻的影响。当我们增强外部对流效果时，外部热阻明显降低。材料的热导率和介电层的厚度是内部热阻的重要因素。我们可能会提出这些结果来设计和开发LED器件的散热封装的整体原理，以提高LED的性能。

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来源
《Sixth International Conference on Solid State Lighting》|2006年|P.63371J.1-63371J.7|共7页
会议地点 San DiegoCA(US)
作者
Farn-Shiun Hwu; Gwo-Jiun Sheu; Jyh-Chen Chen;
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作者单位

Department of Mechanical Engineering, National Central University, Jung-Li, Taiwan 32054, ROC;

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会议组织
原文格式 PDF
正文语种 eng
中图分类电气照明;
关键词
LED; dielectric layer; packaging; thermal management;

机译：LED;介电层;封装;热管理;

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机译：LED封装的紧凑型热模型的性能
2. Possibilities of adjusting the light characteristics of illuminating devices based on white and colored LEDs [J] . S. M. Gvozdev A. B. Karabin and A. A. Libentsova Journal of Optical Technology . 2010,第7期

机译：调整基于白色和彩色LED的照明设备的光特性的可能性
3. Possibilities of adjusting the light characteristics of illuminating devices based on white and colored LEDs [J] . Gvozdev S.M., Karabin A.B., Libentsova A.A. Journal of optical technology . 2010,第7期

机译：调整基于白色和彩色LED的照明设备的光特性的可能性
4. Thermal Modeling and Performance of LED Packaging for Illuminating Device [C] . Farn-Shiun Hwu, Gwo-Jiun Sheu, Jyh-Chen Chen, International Conference on Solid State Lighting . 2006

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Thermal Modeling and Performance of LED Packaging for Illuminating Device

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